LZ201-CN Module Datasheet

LZ201-CN is an LTE Cat.1 cellular network module that Tuya has developed. Embedded with the LTE CAT.1 network communication protocol stack and rich library functions, it consists of a highly integrated LTE Cat.1 chip (UIS8910DM) and a few peripheral circuits.

Product overview

LZ201-CN has the Cortex A5 processor and Cat.1bis modem inside and is integrated with the 64-MB Nor flash memory and 128-MB PSRAM. It supports interfaces including USB, UART, SDIO, SPI, I2C, I2S and ADC. Besides, it also supports peripherals, such as display, camera, keyboard matrix, microphone, speaker, charging, MicroSD card and USIM card.

Features

• Cortex A5 processor and the clock rate of CPU: 500 MHz
• Supply voltage:
  • Working voltage: 3.4 to 4.3 V
  • Typical working voltage: 3.8 V
• SIM card: 1.8V/3V
• Features of LTE Cat.1:
  • Frequency band
    • LTE-FDD: B1/B3/B5/B8
    • LTE-TDD: B34/38/39/40/41 (2535 to 2655 MHz)
  • Data rate
    • LTE-FDD: Max 10 Mbit/s (downlink)/Max 5 Mbit/s (uplink)
    • LTE-TDD: Max 8.2 Mbit/s (downlink)/Max 3.4 Mbit/s (uplink)
  • Transmit power: 23 ± 2 dBm
  • Receiving sensitivity: Less than -98 dBm
  • Antenna impedance 50Ω, an external antenna required
• Bluetooth LE 4.2
• Wi-Fi SCAN
• Interfaces:
  • 1 USB 2.0
  • 3 UARTs
  • 2 I2Cs
  • 1 PCM/I2S
  • 1 SDIO
  • 1 SPI
  • 3 ADC
• Peripherals:
  • SPI display with the resolution of QVGA 320x240 and 30 FPS
  • SPI/MIPI camera with 300,000 pixels
  • 4*5 matrix keyboard
  • 1 microphone
  • 1 speaker
  • MicroSD card
  • Charging
• Normal working temperature: -30°C to +75℃ ¹
• Extended working temperature: -40°C to +85℃ ²
• Support to upgrade firmware with the OTA technology

Note:
¹ indicates that when the module is in the working temperature range, the performance related to the module meets the 3GPP standard.
² indicates that when the module is in the working temperature range, the module can still work normally, but some RF indicators might exceed the standard values in the 3GPP slightly.

Applications

• Public utilities: Meter reading (water, gas and electricity), intelligent water affairs (pipe network, leakage and quality inspection), smart fire extinguisher, fire hydrant, etc.
• Smart health: Drug traceability, remote medical monitoring, blood pressure meter, blood glucose meter, heart armour monitoring, baby monitor, etc.
• Smart city: Smart street lights, smart parking, urban trash can management, public safety alarms, urban environment monitoring (water pollution, noise, air quality PM2.5, etc.)
• Consumers: Wearable devices, bicycles, mopeds anti-theft, smart luggage, VIP tracking (children, elderly, pets and vehicle rental), and payment/POS machines
• Agricultural environment: Precision planting (environment parameters: water, temperature, sunshine, biocide and fertilizer), animal husbandry (health and tracking), aquaculture and food safety traceability
• Logistics warehousing: Asset, container tracking, warehouse management, fleet management tracking, and logistics status tracking.
• Smart building: Access control, smart HVAC, smoke detection, fire detection and elevator failure/repair
• Manufacturing industry: Production, equipment status monitoring, energy facilities, oil and gas monitoring, chemical park monitoring, large-scale rental equipment and predictive maintenance (home appliances, machinery, etc.)

Module interfaces

Pin distribution

LZ201-CN has 144 pins in total. Among them, there are 80 LCC-packaged pins and 64 LGA-packaged pins.

The diagram of correspondence between pin ID and pin name

Pin definition

Pin number	Pin name	Signal type	Description
1	WAKEUP_IN	I	Wakeup pin, used by the external device to wake up the module. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 10.
2	AP_READY*	I	Used to detect the status of the processor. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 11.
3	WAKEUP_OUT*	O	Wakeup pin, used by the module to wake up the external device. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 5.
4	W_DISABLE_N*	I	Flight mode. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 8.
5	NET_MODE	PI	Used to indicate the network registration status. Flashing fast indicates “in the progress of searching for the network”. Flashing slowly indicates “already connected to the Tuya Cloud”.
6	NET_STATUS*	O	Used to indicate the network running status. In OpenCPU mode, it can be used as GPIO 9.
7	VDD_EXT	PO	1.8V. Offer the high level to the external GPIO. Not connected when it is not used.
8	GND	-	Ground.
9	GND	-	Ground.
10	USIM_GND	-	Ground.
11	ISENSE	I	Used to detect the current for charging.
12	VBAT_SENSE	I	Used to detect the voltage of the battery. Try to be as close to the positive electrode of the battery as possible. If the VBAT pin is not connected, the low-voltage shutdown function must be turned off, otherwise, the module will automatically shut down.
13	USIM_DET	I	Used to detect the hot swap of the USIM card. Not connected to anything when it is not used.
14	USIM_VDD	PO	Working voltage of the USIM card. The module automatically identifies the USIM card of 1.8 or 3.0V.
15	USIM_DATA	I/O	Data signal of the USIM card.
16	USIM_CLK	O	Clock signal of the USIM card.
17	USIM_RST	O	Reset signal of the USIM card.
18	VDRV	O	Enable the charging circuit.
19	GND	-	Ground.
20	RESET_N	I	Reset signal, low active.
21	PWRKEY	I	Power on or off.
22	GND	-	Ground.
23	SD_INS_DET	I	Used to detect the SD card. In OpenCPU mode, it can be used as GPIO 7.
24	PCM_DIN	I	Used to input PCM voice data. In OpenCPU mode, it can be used as GPIO 2.
25	PCM_DOUT	O	Used to output PCM voice data. In OpenCPU mode, it can be used as GPIO 3.
26	PCM_SYNC	I/O	Signal to synchronize PCM voices. In OpenCPU mode, it can be used as GPIO 1.
27	PCM_CLK	I/O	Clock signal of PCM voices. In OpenCPU, it can be used as GPIO 0.
28	SD_DATA3	I	Data 3 of the SD card. Reuse the Wi-Fi SDIO.
29	SD_DATA2	I	Data 2 of the SD card. Reuse the Wi-Fi SDIO.
30	SD_DATA1	I	Data 1 of the SD card. Reuse the Wi-Fi SDIO.
31	SD_DATA0	I	Data 0 of the SD card. Reuse the Wi-Fi SDIO.
32	SD_CLK	O	Clock signal of the SD card. Reuse the Wi-Fi SDIO.
33	SD_CMD	I/O	Command of the SD card. Reuse the Wi-Fi SDIO.
34	VDD_SDIO	PO	Power supply of the SD card. Reuse the Wi-Fi SDIO.
35	ANT_BT/WIFI	AI/O	Bluetooth and Wi-Fi antenna.
36	GND	-	Ground.
37	SPI_CS_N	I	SPI chip selection.
38	SPI_MOSI	I	SPI MOSI.
39	SPI_MISO	O	SPI MISO.
40	SPI_CLK	O	Clock signal of the SPI.
41	I2C_SCL	OD	Clock signal of the I2C. In OpenCPU mode, it can be used as GPIO 14.
42	I2C_SDA	OD	Data signal of the I2C. In OpenCPU mode, it can be used as GPIO 15.
43	ADC2	AI	Interface 2 for analog-to-digital conversion.
44	ADC1	AI	Interface 1 for analog-to-digital conversion.
45	ADC0	AI	Interface 0 for analog-to-digital conversion.
46	GND	-	Ground.
47	ANT_GNSS	AI	GNSS antenna, which is not supported by LZ201-CN but supported by LZ211-CN.
48	GND	-	Ground.
49	ANT_MAIN	AI/O	Main antenna interface.
50~54	GND	-	Ground.
55	RESERVED	-	Reserved.
56	GND	-	Ground.
57	VBAT_RF	P	Power supply for the module RF. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 2 A.
58	VBAT_RF	P	Power supply for the module RF. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 2 A.
59	VBAT_BB	P	Power supply for the baseband. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 1 A.
60	VBAT_BB	P	Power supply for the baseband. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 1 A.
61	STATUS*	O	Module status output. In OpenCPU mode, it can be used as GPIO 23.
62	UART1_RI	O	Output of ring. In OpenCPU mode, it can be used as GPIO 12.
63	RESERVED63	O	Reserved.
64	UART1_CTS	O	UART1-clean to send. In OpenCPU mode, it can be used as GPIO 18.
65	UART1_RTS	I	UART1-request to send. In OpenCPU mode, it can be used as GPIO 19.
66	UART1_DTR	I	UART1-data terminal ready. It’s the sleep control pin.
67	UART1_TXD	O	UART1-transmit data. Support the MCU connection.
68	UART1_RXD	I	UART1-receive data. Support the MCU connection.
69	USB_DP	I/O	USB differential data plus. It supports module burning and calibration.
70	USB_DM	I/O	USB differential data minus. It supports module burning and calibration.
71	USB_VBUS	PI	Pin for plug-in detection.
72	GND	-	Ground.
73	SPK_P	O	Speaker (+).
74	SPK_N	O	Speaker (-).
75	MIC_P	I	Microphone (+).
76	GND	-	Ground.
77	MIC_N	I	Microphone (-).
78	KEYIN1	I/O	Key input 1.
79	KEYIN2	I/O	Key input 2.
80	KEYIN3	I/O	Key input 3.
81	KEYIN4	I/O	Key input 4.
82	KEYIN5	I/O	Key input 5.
83	KEYOUT0	I/O	Key output 0.
84	KEYOUT1	I/O	Key output 1.
85 to 112	GND	-	Ground.
113	KEYOUT2	I/O	Key output 2.
114	KEYOUT3	I/O	Key output 3.
115	USBBOOT	I/O	If you input 0 through the keyboard and pull the voltage to VDD_EXT before the module is powered on, the module will enter the USB download mode.
116	RESERVED116	-	Reserved and not connected to anything.
117	CLK26M_OUT	O	The frequency of the output interface of the clock signal is 26 MHz.
118	RESERVED118	-	Reserved and not connected to anything.
119	LCD_FMARK	O	SPI LCD frame alignment signal.
120	LCD_RSTB	O	SPI LCD reset signal.
121	LCD_SEL	O	SPI LCD selection.
122	LCD_CS	O	SPI LCD chip select.
123	LCD_CLK	O	SPI LCD clock signal.
124	LCD_SDC	O	SPI LCD selection of data command.
125	LCD_SIO	O	SPI LCD serial input/output.
126	VDDLCD	P	External LCD power supply
127	PM_ENABLE	O	Enable the external power supply LDO. In OpenCPU mode, it can be used as GPIO 13.
128	VDDCAMA	P	Camera VCAMA power supply.
129	CAM_PWDN	I/O	Camera CAM_PWDN signal.
130	CAM_SI1	I/O	Camera CAM_SI1 signal.
131	CAM_SI0	I/O	Camera CAM_SI0 signal.
132	CAM_RSTL	I/O	Camera CAM_RSTL signal.
133	CAM_REFCLK	O	Camera CAM_REFCLK signal.
134	CAM_SCK	I/O	Camera CAM_SCK signal.
135	UART2_RXD/WAKE_WLAN	O	The serial interface 2 receives data and supports module burning and calibration. It is also used by the external Wi-Fi module to wake up LZ201*. In OpenCPU mode, it can be used as GPIO 20.
136	UART2_TXD/WLAN_EN	O	The serial interface 2 transmits data and supports module burning and calibration. It is used by the external Wi-Fi module to enable *. In OpenCPU mode, it can be used as GPIO 21.
137	UART3_RXD/KEYOUT4	I	The serial interface 3 receives data and reuses KEYOUT4.
138	UART3_TXD/KEYOUT5	O	The serial interface 3 transmits data and reuses KEYOUT5.
139	ZSP_UART_TXD/BT_EN	O	The pin is used to output ZSP logs and also used by the external Bluetooth LE mesh module to enable *. In OpenCPU mode, it can be used as GPIO 22.
140	VDDCAMD	P	Camera VCAMD power supply.
141	I2C2_SCL	I/O	I2C clock signal.
142	I2C2_SDA	I/O	I2C data signal In OpenCPU mode, it can be used as GPIO 17.
143	DBG_TXD	I	The pin is used for debugging and transmitting data.
144	DBG_RXD	O	The pin is used for debugging and receiving data.

Note: P indicates a power supply pin and I/O indicates an input/output pin. “*” indicates that the function is not supported currently.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	90	℃
VBAT	Supply voltage	-0.3	4.6	V

ESD features

Location	Air charge	Contact charge
GND	±10 KV	±5 KV
Antenna interface	±8 KV	±4 KV
Other interfaces	±1 KV	±0.5 KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-30	-	75	℃
Ta	Extended working temperature	-40	-	85	℃
VBAT	Working voltage	3.4	3.8	4.3	V

Direct-current parameters

1.8 V Digital I/O

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
VIL	I/O low-level input	-	-	0.3*VCC	V
VIH	I/O high-level input	0.7*VCC	-	VCC	V
VOL	I/O low-level output	-	-	0.2*VCC	V
VOH	I/O high-level output	0.8*VCC	-	VCC	V

Standby and transmission power consumption

Working Mode	Condition	Average value	Peak value (Typical value)	Unit
Standby current	LTE-TDD	5.2	-	mA
Standby current	LTE-FDD	3.4	-	mA
Constantly transmit (23 dBm)	LTE-TDD	300	600*	mA
Constantly transmit (23 dBm)	LTE-FDD	550	600*	mA

Note: The 600 mA current is generated when the VBAT is in parallel connected to the 1000 μA capacitor. If there is no large capacitor, the peak current will be above 1A. So please pay attention to the power input.

RF parameters

Basic RF features

Parameter	Description
LTE-FDD frequency band	LTE-FDD: B1/B3/B5/B8
LTE-TDD frequency band	LTE-TDD: B34/B38/B39/B40/B41
Wireless standard	3GPP R13
LTE-FDD rate	LTE-FDD: Max 10 Mbps (downlink)/max 5 Mbps (uplink)
LTE-TDD rate	LTE-TDD: Max 8.2 Mbps (downlink)/max 3.4 Mbps (uplink)
Antenna	Characteristic impedance of 50 Ω

TX performance

TX performance:

Frequency band	Minimum value	Maximum value	Unit
LTE-FDD B1	＜-39	23±2	dBm
LTE-FDD B3	＜-39	23±2	dBm
LTE-FDD B5	＜-39	23±2	dBm
LTE-FDD B8	＜-39	23±2	dBm
LTE-TDD B34	＜-39	23±2	dBm
LTE-TDD B38	＜-39	23±2	dBm
LTE-TDD B39	＜-39	23±2	dBm
LTE-TDD B40	＜-39	23±2	dBm
LTE-FDD B41	＜-39	23±2	dBm

RX performance

Receiving sensitivity:

Frequency band	Typical value	Unit
LTE-FDD B1	-98.5	dBm
LTE-FDD B3	-98	dBm
LTE-FDD B5	-98	dBm
LTE-FDD B8	-98.5	dBm
LTE-FDD B34	-100	dBm
LTE-FDD B38	-98.5	dBm
LTE-FDD B39	-101	dBm
LTE-FDD B40	-98.5	dBm
LTE-FDD B41	-98.5	dBm

Antenna information

Antenna type

The module does not have its own onboard PCB antenna, and the third party needs to provide an antenna.

The antenna can be an external rod antenna, a spring antenna, an IPEX- FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.

• Rod antenna

  

• FPC antenna

  

Antenna design requirements

• Ensure that the characteristic impedance of the transmission line is 50Ω.
• Since the antenna line loss needs to be less than 0.3 dB, keep the PCB trace as short as possible.
• When designing the layout, you should choose the most direct and shortest route, to prevent routing through layers or holes, and rectangles and sharp angles.
• There is a good ground reference for the antenna, which stays away from other signal wires.
• It is recommended that you use the complete ground plane as the ground reference.
• Strengthen the connection between the ground around the antenna and the main ground.
• It is recommended that the antenna be at least 10 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

LZ201-CN has 144 pins in total. Among them, there are 80 LCC-packaged pins and 64 LGA-packaged pins.

The dimensions of LZ201-CN are 29±0.35 mm (W)×32±0.35 mm (L)×2.4±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

Mechanical dimensions and dimensions of the back of the pad

Note: The tolerance for the length and width of the module is ±0.35 mm, the height is ±0.15 mm, and the thickness is ±0.1 mm.

PCB packaging diagram-SMT

Top/bottom view of the module

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
LZ201-CN	2800	Tape reel	700	4