TCS600U Module Datasheet

Last Updated on : 2024-06-14 03:01:47download

TCS600U is an LTE Cat.1 cellular module developed by Tuya Smart. The module consists of a highly integrated LTE Cat.1 chip UIS8910DM and peripheral circuits. It has a built-in LTE Cat.1 network communication protocol stack and library functions.

Overview

The TCS600U module is built around an Arm Cortex-A5 processor and Cat.1 bis modem and embedded with 64 MB NOR flash and 128 MB PSRAM. It provides a wide array of interfaces including USB, UART, SDIO, SPI, I2C, I2S, and ADC for supporting peripherals such as the display, camera, microphone, speaker, microSD card, and USIM card.

Features

  • Built-in Arm Cortex-A5 500 MHz application processor
  • Supply voltage range:
    • Operating voltage: 3.4V to 4.3V
    • Typical operating voltage: 3.8V
  • SIM card: 1.8V and 3V supported
  • LTE Cat.1 features:
    • Frequency bands

      • LTE-FDD: bands 1, 3, 5, and 8
      • LTE-TDD: bands 34, 38, 39, 40, and 41
    • Data transmission rate

      • LTE-FDD: Maximum download speed of 10 Mbit/s, and maximum upload speed of 5 Mbit/s
      • LTE-TDD: Maximum download speed of 8.2 Mbit/s, and maximum upload speed of 3.4 Mbit/s
    • Transmit power: 23 dBm ± 2 dBm

    • Receiving sensitivity: less than -99 dBm

    • 50Ω antenna impedance, with an external antenna required

  • Interfaces:
    • 1 USB 2.0 interface
    • 2 UART interfaces
    • 3 I2C interfaces
    • 1 PCM/I2C interface
    • 1 SDIO interface
    • 1 SPI interface
    • 2 ADC interfaces
    • 1 quad SPI flash interface
  • Peripherals:
    • SPI display
    • SPI/MIPI camera in 640 × 480 pixel resolution
    • 1-channel microphone
    • 1-channel speaker
    • A microSD card
  • Operating temperature range: -30°C to +75°C 1
  • Extended temperature range: -40°C to +85°C 2
  • Update firmware over the air.
  • 1: Within the operating temperature range, the module is 3GPP compliant.
  • 2: Within the extended temperature range, the module is able to operate properly. Only the values of one or several RF parameters might exceed the specified tolerances of 3GPP specifications.

Scope of applications

  • Public utilities: smart metering (water, gas, and electricity), smart water management (pipe network, leakage, and quality inspection), smart fire extinguisher, and smart fire hydrant.
  • Smart health: medication tracker, remote patient monitoring, blood pressure monitor, blood glucose meter, health-tracking wearables, and baby monitor.
  • Smart city: smart street lighting, smart parking, smart waste bin, public security alarm, and environment monitoring (water pollution, noise, air quality PM2.5, and more).
  • Consumer electronics: wearable, bicycle, GPS tracker (children, the elderly, pets, and car rental), smart suitcase, and POS machine.
  • Agriculture and environment: precision planting (environmental parameters: water, temperature, light, medicine, fertilizer), livestock farming (health and tracking), aquaculture, and food quality monitoring.
  • Logistics and warehousing: asset and container tracking, warehouse management, fleet tracking, and courier tracking.
  • Smart buildings: access control, smart heating, ventilation, and air conditioning (HVAC), smoke detector, fire alarm, and elevator repair and maintenance.
  • Manufacturing: equipment monitoring, energy monitoring, chemicals plants monitoring, large rental equipment, and predictive maintenance (home appliance and machinery).

Module interfaces

Pin definition

TCS600U is equipped with a total of 106 pins, including 76 leadless chip carrier (LCC) pins and 30 land grid array (LGA) pins. The pinout is as follows:

TCS600U Module Datasheet

Pin definition

Pin No. Pin name I/O type Description
1 SPI_CLK DO SPI1 clock signal output. It can be used as GPIO93 in OpenCPU mode.
2 SPI_DIN DI SPI1 data input. It can be used as GPIO12 in OpenCPU mode.
3 SPI_DOUT DO SPI1 data output. It can be used as GPIO11 in OpenCPU mode.
4 SPI_CS DO SPI1 chip select signal. It can be used as GPIO10 in OpenCPU mode.
5 USIM_CLK DO USIM card clock signal.
6 USIM_DATA IO USIM card data signal.
7 USIM_RST DO USIM card reset signal.
8 USIM_VDD PO Power supply for the USIM card. Either 1.8V or 3.0V is supported by the module automatically. IOMAX = 50 mA.
9 USIM_CD DI USIM card hot-plug detection, which is disabled by default in the software. Pull this pin up to V_GLOBAL_1V8.
10 CAM_MCLK DO Camera master clock (MCLK) output.
11 CAM_I2C_SCL IO Camera I2C clock signal, which can also be used as a general-purpose I2C interface.
12 CAM_I2C_SDA IO Camera I2C data signal. It can also be used as a general-purpose I2C interface or as GPIO17 in OpenCPU mode.
13 CAM_SPI_CLK DI Camera SPI clock input.
14 CAM_SPI_D0 DI Camera SPI data input 0.
15 CAM_SPI_D1 DI Camera SPI data input 1.
16 CAM_PWDN DO Camera power down.
17 CAM_VDD PO Analog power supply for the camera, with voltage ranging from 1.6V to 3.2V, and defaulting to 1.8V. IOMAX = 100 mA. By default, the analog power is down after the module is powered on.
18 GND - Ground.
19 ADC0 AI Analog-to-digital converter (ADC).
Input voltage: 0 to VBAT
Channel: 0
Resolution: 11 bits
20 ADC1 AI Analog-to-digital converter (ADC).
Input voltage: 0 to VBAT
Channel: 1
Resolution: 11 bits
21 SPK- AO Negative audio differential output, with no built-in power amplifier. It can drive a 32Ω receiver. An external power amplifier is required to connect to an 8Ω external speaker.
22 SPK+ AO Positive audio differential output, with no built-in power amplifier. It can drive a 32Ω receiver. An external power amplifier is required to connect to an 8Ω external speaker.
23 MIC- AI Negative microphone input signal.
24 MIC+ AI Positive microphone input signal.
25 MIC_BIAS PO Microphone bias voltage.
26 USB_DP IO Positive USB differential signal, which should have a 90Ω differential impedance.
27 USB_DM IO Negative USB differential signal, which should have a 90Ω differential impedance.
28 USB_VBUS DI Used to detect USB port insertion.
Input voltage: 3.3V to 5.25V
Vnorm = 5.0V
Insertion of a USB device will charge and start up the module. As a result, the module cannot be shut down in this state.
29 VBAT PI Power supply for the module.
Supply voltage: 3.4V to 4.3V.
Nominal voltage: 3.8V.
The external power supply should output 2A current. It is recommended to add a surge protector.
30 GND - Ground.
31 MAIN_RXD DI The main UART receives data.
32 MAIN_TXD DO The main UART sends data.
33 MAIN_CTS DO DTE main UART clear to send, connected to DTE’s CTS. It can be used as GPIO19 in OpenCPU mode.
34 MAIN_RTS DI DTE main UART request to send, connected to DTE’s RTS. It can be used as GPIO18 in OpenCPU mode.
35 GND - Ground.
36 VBAT PI Power supply for the module.
Supply voltage: 3.4V to 4.3V.
Nominal voltage: 3.8V.
The external power supply should output 2A current. It is recommended to add a surge protector.
37 VBAT PI Power supply for the module.
Supply voltage: 3.4V to 4.3V.
Nominal voltage: 3.8V.
The external power supply should output 2A current. It is recommended to add a surge protector.
38 GND - Ground.
39 SD_DATA0 DI/IO SDIO data bit 0.
40 SD_DATA1 DO/IO SDIO data bit 1.
41 GND - Ground.
42 BOOT DI Short this pin to V_GLOBAL_1V8 on startup will make the module run in download mode. Leaving this pin floating will start the module in normal mode.
43 GND - Ground.
44 GND - Ground.
45 GND - Ground.
46 LTE_ANT AIO LTE antenna output, with 50Ω characteristic impedance.
47 GND - Ground.
48 SD_CMD DO/IO SDIO command signal.
49 SD_DATA2 DI/IO SDIO data bit 2.
50 SD_DATA3 DI/IO SDIO data bit 3.
51 W_DISABLE* DI Used to force the module into airplane mode. It can be used as GPIO22 in OpenCPU mode.
52 NET_MODE* DO Indicate the mobile network standard under which the module is registered.
53 SLEEP_IND* DO Indicate the sleep mode, or UART2_TXD. It can be used as GPIO21 in OpenCPU mode.
54 STATUS* DO Indicate the module’s operating status, or UART2_RXD. It can be used as GPIO20 in OpenCPU mode.
55 NET_STATUS DO Indicate the module’s network registration mode, which applies when the module operates in self-processing mode.
56 I2C2_SDA IO I2C2 data signal. It can be used as GPIO15 in OpenCPU mode.
57 I2C2_SCL IO I2C2 clock signal. It can be used as GPIO14 in OpenCPU mode.
58 PCM_SYNC/SPI_FLASH_CS DO PCM audio data sync signal, or SPI_FLASH_CS.
59 PCM_DIN/SPI_FLASH_D0 DI/IO PCM audio data input, or SPI_FLASH_D0.
60 PCM_DOUT/SPI_FLASH_D1 DO/IO PCM audio data output, or SPI_FLASH_D1.
61 PCM_CLK/SPI_FLASH_CLK DO PCM audio clock signal, or SPI_FLASH_CLK.
62 LCD_TE DO LCD SPI frame sync signal.
63 LCD_SPI_RS DO LCD SPI register select.
64 LCD_RST DO LCD SPI reset signal.
65 LCD_SPI_CS DO LCD SPI chip select signal.
66 LCD_SPI_DOUT DO LCD SPI data signal.
67 LCD_SPI_CLK DO LCD SPI clock signal.
68 CAM_VDDIO PO Digital power supply for the camera, with voltage ranging from 1.4V to 2.1V, and defaulting to 1.8V.
IOMAX = 100 mA.
By default, the digital power is off after the device is powered on.
69 SPI_FLASH_D2 IO External SPI flash interface.``
70 MAIN_RI/SPI_FLASH_D3 IO UART1 ring indicator, or SPI_FLASH_D3.
71 DBG_TXD DO Debugging interface, used to output AP logs.
72 DBG_RXD DI Debugging interface, used to receive commands.
73 GND - Ground.
74 POWER_KEY DI Control module power on/off, with an internal pull-up to VBAT.
75 RESET DI Reset module, active low, with an internal pull-up to VBAT.
76 V_GLOBAL_1V8 PO Provide fixed 1.8V output. IOMAX = 50 mA.
This pin is automatically enabled upon startup and cannot be disabled. It can be used as pull-up power for peripherals.
77~92 GND - Ground.
113 RESERVED - Reserved pin.
120 CAM_RST DO Camera reset signal.
129 RESERVED - Reserved pin.
131 RESERVED - Reserved pin.
132 SD_CLK DO SDIO clock signal.
133 VMMC_VDD PO Power supply for SDIO, defaulting to 3.1V. IOMAX = 150 mA.
134 LCD_VDDIO PO Digital power supply for LCD, defaulting to 1.8V. IOMAX = 200 mA.
136 RESERVED - Reserved pin.
138 LCD_AVDD PO Analog power supply for LCD, defaulting to 3.0V. IOMAX = 150 mA.
143 RESERVED - Reserved pin.
145 USIM2_RST DO USIM2 card reset signal.
146 USIM2_DATA4 IO USIM2 card data signal.
147 USIM2_CLK4 DO USIM2 card clock signal.
148 USIM2_VDD4 PO Power supply for USIM2 card. The module automatically switches between 1.8V and 3.0V.
IOMAX = 50 mA.
  • * indicates the specific feature cannot be implemented with MCU integration, but it can be implemented through GPIO configuration in OpenCPU mode.
  • 3: With OpenCPU SDK based firmware, you can configure this GPIO pin as you wish.
  • 4: Dual SIM cards are not supported currently. If you require a dual SIM application, contact the product manager for customization.

Electrical parameters

Absolute electrical parameters

Parameter Description Min value Max value Unit
VBAT Supply voltage -0.3 4.7 V
VBUS USB detection -0.3 5.5 V
Ipk Power supply peak current 0 1.5 A
Vio Voltage of digital interface -0.3 2.3 V
Vadc Voltage of analog interface -0.3 VBAT V

Normal operating conditions

Parameter Description Min value Typical value Max value Unit
VBAT Operating voltage 3.4 3.8 4.3 V
VBATdrop Voltage drop at maximum power - - 400 mV
VBUS USB detection 3.3 5.0 5.25 V
IVBAT Peak current - 1.2 1.5 A

Operating and storage temperature

Parameter Description Min value Max value Unit
Ts Storage temperature -40 90 °C
Ta Normal operating temperature -30 75 °C
Ta Extended operating temperature -40 85 °C

Direct current parameters

1.8V digital I/O

Parameter Description Min value Typical value Max value Unit
VIL I/O low-level input - - 0.3 × VCC V
VIH I/O high-level input 0.7 × VCC - VCC V
VOL I/O low-level output - - 0.2 × VCC V
VOH I/O high-level output 0.8 × VCC - VCC V

Power consumption during standby and continuous transmission

Parameter Condition Average value Peak (Typical) value Unit
Standby current LTE-TDD paging cycle 128 1.78 - mA
Standby current LTE-FDD paging cycle 128 1.8 - mA
Continuous transmission (23 dBm) LTE-TDD 300 600 mA
Continuous transmission (23 dBm) LTE-FDD 550 600 mA
  • The standby current is the minimum hardware current, excluding the TuyaOS application and heartbeat.
  • The 600 mA current appears when VBAT is connected in parallel with a 1,000 μA capacitor. When there is no large capacitor, the peak current of the module reaches more than 1A. Pay attention to the power input.

Power consumption of persistent connections over real network

China Mobile

Frequency band: B40, and extended signal strength (CESQ) of real network: 72.

Parameter Description Typical value Unit
IBAT Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (default configurations). 7.79 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (default configurations). 3.11 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (ultra-low power). 3.93 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (ultra-low power). 2.25 mA

China Unicom

Test conditions: frequency band: Band1, and extended signal strength (CESQ) of real network: 60.

Parameter Description Typical value Unit
IBAT Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (default configurations). 8.33 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (default configurations). 3.79 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (ultra-low power). 3.84 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (ultra-low power). 2.03 mA

China Telecom

Test conditions: frequency band: Band1, and extended signal strength (CESQ) of real network: 62.

Parameter Description Typical value Unit
IBAT Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (default configurations). 7.62 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (default configurations). 3.82 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (ultra-low power). 4.39 mA
Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (ultra-low power). 3.07 mA

During the real network test, the network signal strength, registered frequency band, and server response time all have a great effect on test values. Therefore, the data is just for your reference.

RF parameters

Basic RF features

Parameter Description
LTE-FDD frequency band LTE-FDD: bands 1, 3, 5, and 8
LTE-TDD frequency band LTE-TDD: bands 34, 38, 39, 40, and 41
Wireless standard 3GPP Release 13
LTE-FDD speed Maximum download speed of 10 Mbit/s
Maximum upload speed of 5 Mbit/s
LTE-TDD speed Maximum download speed of 8.2 Mbit/s
Maximum upload speed of 3.4 Mbit/s
Antenna type 50Ω characteristic impedance

Transmission performance

Continuous transmission performance

Frequency bands Min value Max value Unit
LTE-FDD B1 <-39 23±2 dBm
LTE-FDD B3 <-39 23±2 dBm
LTE-FDD B5 <-39 23±2 dBm
LTE-FDD B8 <-39 23±2 dBm
LTE-TDD B34 <-39 23±2 dBm
LTE-TDD B38 <-39 23±2 dBm
LTE-TDD B39 <-39 23±2 dBm
LTE-TDD B40 <-39 23±2 dBm
LTE-FDD B41 <-39 23±2 dBm

Receiving performance

Receiving sensitivity:

Frequency bands Typical value Unit
LTE-FDD B1 (10 Mbit/s) -99 dBm
LTE-FDD B3 (10 Mbit/s) -99 dBm
LTE-FDD B5 (10 Mbit/s) -99 dBm
LTE-FDD B8 (10 Mbit/s) -99 dBm
LTE-FDD B34 (10 Mbit/s) -99 dBm
LTE-FDD B38 (10 Mbit/s) -99 dBm
LTE-FDD B39 (10 Mbit/s) -99 dBm
LTE-FDD B40 (10 Mbit/s) -99 dBm
LTE-FDD B41 (10 Mbit/s) -99 dBm

Electrostatic discharge (ESD) protection

During the application of the module, static electricity is generated by the human body and charged friction between microelectronics and then discharged to the module in various ways. This might damage the module, so ESD protection must be taken seriously. ESD protection measures should be taken in the process of production assembly, testing, research and development, especially in product design. For example, ESD protection is added at the interfaces or ESD-sensitive points in the circuit design, and anti-ESD gloves are worn during production.

Location Air discharge Contact discharge
VBAT, GND ±10 kV ±5 kV
Antenna interface ±10 kV ±5 kV
Others ±1 kV ±0.5 kV

Antenna information

Antenna type

This module does not come with an antenna, so an external antenna is required.

You can choose one from the external rubber antenna, helical antenna, FPC antenna with IPEX connector, and PCB antenna. The antenna can typically be a monopole antenna, planar inverted-F antenna (PIFA), inverted-F antenna (IFA), and loop antenna.

  • Rubber antenna:

    TCS600U Module Datasheet

  • FPC antenna with IPEX connector:

    TCS600U Module Datasheet

  • Built-in FPC antenna

    TCS600U Module Datasheet

Antenna design requirements

  • Make sure the characteristic impedance of the transmission line is 50Ω.
  • The antenna line loss should be less than 0.3 dB. Thus, keep the PCB trace as short as possible.
  • The PCB layout should be as straight as possible to avoid vias and layer changes. Also, steer clear of right-angle and sharp-angle traces.
  • A good reference ground should be set around the PCB traces, and other signal lines should be kept away from the antenna.
  • A complete ground is recommended as a reference ground.
  • The ground plane around the antenna must reinforce its connection to the main ground plane of the motherboard.
  • The distance between the antenna and other mental components should be at least 10 mm.

Antenna metrics

Parameter Metrics
VSWR ≤ 2
Efficiency > 30%
Input impedance 50Ω
Insertion loss (< 1 GHz) < 1 dB
Insertion loss (1 to 2.3 GHz) < 1.5 dB
Insertion loss (> 2.3 GHz) < 2.0 dB

Packing and production instructions

Mechanical dimensions

TCS600U is equipped with a total of 106 pins, including 76 leadless chip carrier (LCC) pins and 30 land grid array (LGA) pins.

The dimensions are 21.9 mm±0.35 (W) × 22.9 mm±0.35 (L) × 2.4 mm±0.15 (H), as shown below. The PCB thickness is 0.8 mm±0.1 mm.

Mechanical dimensions

TCS600U Module Datasheet

The tolerances for dimensions of length and width, height, and PCB thickness are ±0.35 mm, ±0.15 mm, and ±0.1 mm respectively.

SMT package

TCS600U Module Datasheet

Stencil opening design

  • Stencil thickness: The stencil thickness of the area for the module should be partly stepped-up within a range from 0.18 mm to 0.2 mm. The stencil thickness in other positions is determined according to product design.
  • LCC pins:
    • The stencil openings are shrunk inward by 0.1 mm, and moved outward by 1 mm along the length direction.
    • Along the width direction, the stencil openings are shrunk inward by 0.16 mm (each side by 0.08 mm) with a length of 1.4 mm (module’s lead length, avoiding solder beads), and are moved outward by 0.2 mm (each side by 0.1 mm) with a length of 2 mm (exposed on the areas outside the bottom of the module leads must get increased tinning).
  • LGA pins: The total opening area of the stencil should be 60% of the total pad area. If the area of a single opening exceeds 60%, you can set a pitch of 0.3 mm.

Production instructions

  1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

    • Instruments or devices required for the SMT process:
      • Surface mount system
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • AOI
    • Instruments or devices required for the baking process:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. A delivered module must meet the following storage requirements:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • A humidity indicator card (HIC) is put in the sealed package.

      TCS600U Module Datasheet

  3. The module needs to be baked in the following cases:

    • The vacuum packaging bag is damaged before unpacking.
    • After unpacking, no HIC is found in the packaging bag.
    • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the first sealing of the bag.
  4. The baking parameter settings are described below:

    • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
    • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
    • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
    • Production can begin after a module has cooled down to below 36°C under natural conditions.
    • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked after exposure for more than 168 hours, do not use reflow soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform the SMT process according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

TCS600U Module Datasheet

  • A: temperature axis

  • B: time axis

  • C: alloy liquidus temperature from 217°C to 220°C

  • D: ramp-up slope from 1°C/s to 3°C/s

  • E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

  • F: temperature above liquidus temperature for 50s to 70s

  • G: peak temperature from 235°C to 245°C

  • H: ramp-down slope from 1°C/s to 4°C/s

    The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

TCS600U Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Shipping packaging Modules per reel Reels per carton
TCS600U 2,800 Tape and reel 700 4