TCS600U Module Datasheet

TCS600U is an LTE Cat.1 cellular module developed by Tuya Smart. The module consists of a highly integrated LTE Cat.1 chip UIS8910DM and peripheral circuits. It has a built-in LTE Cat.1 network communication protocol stack and library functions.

Overview

The TCS600U module is built around an Arm Cortex-A5 processor and Cat.1 bis modem and embedded with 64 MB NOR flash and 128 MB PSRAM. It provides a wide array of interfaces including USB, UART, SDIO, SPI, I2C, I2S, and ADC for supporting peripherals such as the display, camera, microphone, speaker, microSD card, and USIM card.

Features

• Built-in Arm Cortex-A5 500 MHz application processor
• Supply voltage range:
  • Operating voltage: 3.4V to 4.3V
  • Typical operating voltage: 3.8V
• SIM card: 1.8V and 3V supported
• LTE Cat.1 features:

  • Frequency bands

    • LTE-FDD: bands 1, 3, 5, and 8
    • LTE-TDD: bands 34, 38, 39, 40, and 41

  • Data transmission rate

    • LTE-FDD: Maximum download speed of 10 Mbit/s, and maximum upload speed of 5 Mbit/s
    • LTE-TDD: Maximum download speed of 8.2 Mbit/s, and maximum upload speed of 3.4 Mbit/s

  • Transmit power: 23 dBm ± 2 dBm

  • Receiving sensitivity: less than -99 dBm

  • 50Ω antenna impedance, with an external antenna required

• Interfaces:
  • 1 USB 2.0 interface
  • 2 UART interfaces
  • 3 I2C interfaces
  • 1 PCM/I2C interface
  • 1 SDIO interface
  • 1 SPI interface
  • 2 ADC interfaces
  • 1 quad SPI flash interface
• Peripherals:
  • SPI display
  • SPI/MIPI camera in 640 × 480 pixel resolution
  • 1-channel microphone
  • 1-channel speaker
  • A microSD card
• Operating temperature range: -30°C to +75°C ¹
• Extended temperature range: -40°C to +85°C ²
• Update firmware over the air.

Scope of applications

• Public utilities: smart metering (water, gas, and electricity), smart water management (pipe network, leakage, and quality inspection), smart fire extinguisher, and smart fire hydrant.
• Smart health: medication tracker, remote patient monitoring, blood pressure monitor, blood glucose meter, health-tracking wearables, and baby monitor.
• Smart city: smart street lighting, smart parking, smart waste bin, public security alarm, and environment monitoring (water pollution, noise, air quality PM2.5, and more).
• Consumer electronics: wearable, bicycle, GPS tracker (children, the elderly, pets, and car rental), smart suitcase, and POS machine.
• Agriculture and environment: precision planting (environmental parameters: water, temperature, light, medicine, fertilizer), livestock farming (health and tracking), aquaculture, and food quality monitoring.
• Logistics and warehousing: asset and container tracking, warehouse management, fleet tracking, and courier tracking.
• Smart buildings: access control, smart heating, ventilation, and air conditioning (HVAC), smoke detector, fire alarm, and elevator repair and maintenance.
• Manufacturing: equipment monitoring, energy monitoring, chemicals plants monitoring, large rental equipment, and predictive maintenance (home appliance and machinery).

Module interfaces

Pin definition

TCS600U is equipped with a total of 106 pins, including 76 leadless chip carrier (LCC) pins and 30 land grid array (LGA) pins. The pinout is as follows:

Pin definition

Pin No.	Pin name	I/O type	Description
1	SPI_CLK	DO	SPI1 clock signal output. It can be used as GPIO93 in OpenCPU mode.
2	SPI_DIN	DI	SPI1 data input. It can be used as GPIO12 in OpenCPU mode.
3	SPI_DOUT	DO	SPI1 data output. It can be used as GPIO11 in OpenCPU mode.
4	SPI_CS	DO	SPI1 chip select signal. It can be used as GPIO10 in OpenCPU mode.
5	USIM_CLK	DO	USIM card clock signal.
6	USIM_DATA	IO	USIM card data signal.
7	USIM_RST	DO	USIM card reset signal.
8	USIM_VDD	PO	Power supply for the USIM card. Either 1.8V or 3.0V is supported by the module automatically. IOMAX = 50 mA.
9	USIM_CD	DI	USIM card hot-plug detection, which is disabled by default in the software. Pull this pin up to V_GLOBAL_1V8.
10	CAM_MCLK	DO	Camera master clock (MCLK) output.
11	CAM_I2C_SCL	IO	Camera I2C clock signal, which can also be used as a general-purpose I2C interface.
12	CAM_I2C_SDA	IO	Camera I2C data signal. It can also be used as a general-purpose I2C interface or as GPIO17 in OpenCPU mode.
13	CAM_SPI_CLK	DI	Camera SPI clock input.
14	CAM_SPI_D0	DI	Camera SPI data input 0.
15	CAM_SPI_D1	DI	Camera SPI data input 1.
16	CAM_PWDN	DO	Camera power down.
17	CAM_VDD	PO	Analog power supply for the camera, with voltage ranging from 1.6V to 3.2V, and defaulting to 1.8V. IOMAX = 100 mA. By default, the analog power is down after the module is powered on.
18	GND	-	Ground.
19	ADC0	AI	Analog-to-digital converter (ADC). Input voltage: 0 to VBAT Channel: 0 Resolution: 11 bits
20	ADC1	AI	Analog-to-digital converter (ADC). Input voltage: 0 to VBAT Channel: 1 Resolution: 11 bits
21	SPK-	AO	Negative audio differential output, with no built-in power amplifier. It can drive a 32Ω receiver. An external power amplifier is required to connect to an 8Ω external speaker.
22	SPK+	AO	Positive audio differential output, with no built-in power amplifier. It can drive a 32Ω receiver. An external power amplifier is required to connect to an 8Ω external speaker.
23	MIC-	AI	Negative microphone input signal.
24	MIC+	AI	Positive microphone input signal.
25	MIC_BIAS	PO	Microphone bias voltage.
26	USB_DP	IO	Positive USB differential signal, which should have a 90Ω differential impedance.
27	USB_DM	IO	Negative USB differential signal, which should have a 90Ω differential impedance.
28	USB_VBUS	DI	Used to detect USB port insertion. Input voltage: 3.3V to 5.25V Vnorm = 5.0V Insertion of a USB device will charge and start up the module. As a result, the module cannot be shut down in this state.
29	VBAT	PI	Power supply for the module. Supply voltage: 3.4V to 4.3V. Nominal voltage: 3.8V. The external power supply should output 2A current. It is recommended to add a surge protector.
30	GND	-	Ground.
31	MAIN_RXD	DI	The main UART receives data.
32	MAIN_TXD	DO	The main UART sends data.
33	MAIN_CTS	DO	DTE main UART clear to send, connected to DTE’s CTS. It can be used as GPIO19 in OpenCPU mode.
34	MAIN_RTS	DI	DTE main UART request to send, connected to DTE’s RTS. It can be used as GPIO18 in OpenCPU mode.
35	GND	-	Ground.
36	VBAT	PI	Power supply for the module. Supply voltage: 3.4V to 4.3V. Nominal voltage: 3.8V. The external power supply should output 2A current. It is recommended to add a surge protector.
37	VBAT	PI	Power supply for the module. Supply voltage: 3.4V to 4.3V. Nominal voltage: 3.8V. The external power supply should output 2A current. It is recommended to add a surge protector.
38	GND	-	Ground.
39	SD_DATA0	DI/IO	SDIO data bit 0.
40	SD_DATA1	DO/IO	SDIO data bit 1.
41	GND	-	Ground.
42	BOOT	DI	Short this pin to V_GLOBAL_1V8 on startup will make the module run in download mode. Leaving this pin floating will start the module in normal mode.
43	GND	-	Ground.
44	GND	-	Ground.
45	GND	-	Ground.
46	LTE_ANT	AIO	LTE antenna output, with 50Ω characteristic impedance.
47	GND	-	Ground.
48	SD_CMD	DO/IO	SDIO command signal.
49	SD_DATA2	DI/IO	SDIO data bit 2.
50	SD_DATA3	DI/IO	SDIO data bit 3.
51	W_DISABLE*	DI	Used to force the module into airplane mode. It can be used as GPIO22 in OpenCPU mode.
52	NET_MODE*	DO	Indicate the mobile network standard under which the module is registered.
53	SLEEP_IND*	DO	Indicate the sleep mode, or UART2_TXD. It can be used as GPIO21 in OpenCPU mode.
54	STATUS*	DO	Indicate the module’s operating status, or UART2_RXD. It can be used as GPIO20 in OpenCPU mode.
55	NET_STATUS	DO	Indicate the module’s network registration mode, which applies when the module operates in self-processing mode.
56	I2C2_SDA	IO	I2C2 data signal. It can be used as GPIO15 in OpenCPU mode.
57	I2C2_SCL	IO	I2C2 clock signal. It can be used as GPIO14 in OpenCPU mode.
58	PCM_SYNC/SPI_FLASH_CS	DO	PCM audio data sync signal, or SPI_FLASH_CS.
59	PCM_DIN/SPI_FLASH_D0	DI/IO	PCM audio data input, or SPI_FLASH_D0.
60	PCM_DOUT/SPI_FLASH_D1	DO/IO	PCM audio data output, or SPI_FLASH_D1.
61	PCM_CLK/SPI_FLASH_CLK	DO	PCM audio clock signal, or SPI_FLASH_CLK.
62	LCD_TE	DO	LCD SPI frame sync signal.
63	LCD_SPI_RS	DO	LCD SPI register select.
64	LCD_RST	DO	LCD SPI reset signal.
65	LCD_SPI_CS	DO	LCD SPI chip select signal.
66	LCD_SPI_DOUT	DO	LCD SPI data signal.
67	LCD_SPI_CLK	DO	LCD SPI clock signal.
68	CAM_VDDIO	PO	Digital power supply for the camera, with voltage ranging from 1.4V to 2.1V, and defaulting to 1.8V. IOMAX = 100 mA. By default, the digital power is off after the device is powered on.
69	SPI_FLASH_D2	IO	External SPI flash interface.``
70	MAIN_RI/SPI_FLASH_D3	IO	UART1 ring indicator, or SPI_FLASH_D3.
71	DBG_TXD	DO	Debugging interface, used to output AP logs.
72	DBG_RXD	DI	Debugging interface, used to receive commands.
73	GND	-	Ground.
74	POWER_KEY	DI	Control module power on/off, with an internal pull-up to VBAT.
75	RESET	DI	Reset module, active low, with an internal pull-up to VBAT.
76	V_GLOBAL_1V8	PO	Provide fixed 1.8V output. IOMAX = 50 mA. This pin is automatically enabled upon startup and cannot be disabled. It can be used as pull-up power for peripherals.
77~92	GND	-	Ground.
113	RESERVED	-	Reserved pin.
120	CAM_RST	DO	Camera reset signal.
129	RESERVED	-	Reserved pin.
131	RESERVED	-	Reserved pin.
132	SD_CLK	DO	SDIO clock signal.
133	VMMC_VDD	PO	Power supply for SDIO, defaulting to 3.1V. IOMAX = 150 mA.
134	LCD_VDDIO	PO	Digital power supply for LCD, defaulting to 1.8V. IOMAX = 200 mA.
136	RESERVED	-	Reserved pin.
138	LCD_AVDD	PO	Analog power supply for LCD, defaulting to 3.0V. IOMAX = 150 mA.
143	RESERVED	-	Reserved pin.
145	USIM2_RST	DO	USIM2 card reset signal.
146	USIM2_DATA4	IO	USIM2 card data signal.
147	USIM2_CLK4	DO	USIM2 card clock signal.
148	USIM2_VDD4	PO	Power supply for USIM2 card. The module automatically switches between 1.8V and 3.0V. IOMAX = 50 mA.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Min value	Max value	Unit
VBAT	Supply voltage	-0.3	4.7	V
VBUS	USB detection	-0.3	5.5	V
Ipk	Power supply peak current	0	1.5	A
Vio	Voltage of digital interface	-0.3	2.3	V
Vadc	Voltage of analog interface	-0.3	VBAT	V

Normal operating conditions

Parameter	Description	Min value	Typical value	Max value	Unit
VBAT	Operating voltage	3.4	3.8	4.3	V
VBATdrop	Voltage drop at maximum power	-	-	400	mV
VBUS	USB detection	3.3	5.0	5.25	V
IVBAT	Peak current	-	1.2	1.5	A

Operating and storage temperature

Parameter	Description	Min value	Max value	Unit
Ts	Storage temperature	-40	90	°C
Ta	Normal operating temperature	-30	75	°C
Ta	Extended operating temperature	-40	85	°C

Direct current parameters

1.8V digital I/O

Parameter	Description	Min value	Typical value	Max value	Unit
VIL	I/O low-level input	-	-	0.3 × VCC	V
VIH	I/O high-level input	0.7 × VCC	-	VCC	V
VOL	I/O low-level output	-	-	0.2 × VCC	V
VOH	I/O high-level output	0.8 × VCC	-	VCC	V

Power consumption during standby and continuous transmission

Parameter	Condition	Average value	Peak (Typical) value	Unit
Standby current	LTE-TDD paging cycle 128	1.78	-	mA
Standby current	LTE-FDD paging cycle 128	1.8	-	mA
Continuous transmission (23 dBm)	LTE-TDD	300	600	mA
Continuous transmission (23 dBm)	LTE-FDD	550	600	mA

Power consumption of persistent connections over real network

China Mobile

Frequency band: B40, and extended signal strength (CESQ) of real network: 72.

Parameter	Description	Typical value	Unit
IBAT	Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (default configurations).	7.79	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (default configurations).	3.11	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (ultra-low power).	3.93	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (ultra-low power).	2.25	mA

China Unicom

Test conditions: frequency band: Band1, and extended signal strength (CESQ) of real network: 60.

Parameter	Description	Typical value	Unit
IBAT	Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (default configurations).	8.33	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (default configurations).	3.79	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (ultra-low power).	3.84	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (ultra-low power).	2.03	mA

China Telecom

Test conditions: frequency band: Band1, and extended signal strength (CESQ) of real network: 62.

Parameter	Description	Typical value	Unit
IBAT	Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (default configurations).	7.62	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (default configurations).	3.82	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 1-minute heartbeat interval (ultra-low power).	4.39	mA
	Establish a TCP connection. The module automatically goes into sleep mode, with a 5-minute heartbeat interval (ultra-low power).	3.07	mA

RF parameters

Basic RF features

Parameter	Description
LTE-FDD frequency band	LTE-FDD: bands 1, 3, 5, and 8
LTE-TDD frequency band	LTE-TDD: bands 34, 38, 39, 40, and 41
Wireless standard	3GPP Release 13
LTE-FDD speed	Maximum download speed of 10 Mbit/s Maximum upload speed of 5 Mbit/s
LTE-TDD speed	Maximum download speed of 8.2 Mbit/s Maximum upload speed of 3.4 Mbit/s
Antenna type	50Ω characteristic impedance

Transmission performance

Continuous transmission performance

Frequency bands	Min value	Max value	Unit
LTE-FDD B1	＜-39	23±2	dBm
LTE-FDD B3	＜-39	23±2	dBm
LTE-FDD B5	＜-39	23±2	dBm
LTE-FDD B8	＜-39	23±2	dBm
LTE-TDD B34	＜-39	23±2	dBm
LTE-TDD B38	＜-39	23±2	dBm
LTE-TDD B39	＜-39	23±2	dBm
LTE-TDD B40	＜-39	23±2	dBm
LTE-FDD B41	＜-39	23±2	dBm

Receiving performance

Receiving sensitivity:

Frequency bands	Typical value	Unit
LTE-FDD B1 (10 Mbit/s)	-99	dBm
LTE-FDD B3 (10 Mbit/s)	-99	dBm
LTE-FDD B5 (10 Mbit/s)	-99	dBm
LTE-FDD B8 (10 Mbit/s)	-99	dBm
LTE-FDD B34 (10 Mbit/s)	-99	dBm
LTE-FDD B38 (10 Mbit/s)	-99	dBm
LTE-FDD B39 (10 Mbit/s)	-99	dBm
LTE-FDD B40 (10 Mbit/s)	-99	dBm
LTE-FDD B41 (10 Mbit/s)	-99	dBm

Electrostatic discharge (ESD) protection

During the application of the module, static electricity is generated by the human body and charged friction between microelectronics and then discharged to the module in various ways. This might damage the module, so ESD protection must be taken seriously. ESD protection measures should be taken in the process of production assembly, testing, research and development, especially in product design. For example, ESD protection is added at the interfaces or ESD-sensitive points in the circuit design, and anti-ESD gloves are worn during production.

Location	Air discharge	Contact discharge
VBAT, GND	±10 kV	±5 kV
Antenna interface	±10 kV	±5 kV
Others	±1 kV	±0.5 kV

Antenna information

Antenna type

This module does not come with an antenna, so an external antenna is required.

You can choose one from the external rubber antenna, helical antenna, FPC antenna with IPEX connector, and PCB antenna. The antenna can typically be a monopole antenna, planar inverted-F antenna (PIFA), inverted-F antenna (IFA), and loop antenna.

• Rubber antenna:

  

• FPC antenna with IPEX connector:

  

• Built-in FPC antenna

  

Antenna design requirements

• Make sure the characteristic impedance of the transmission line is 50Ω.
• The antenna line loss should be less than 0.3 dB. Thus, keep the PCB trace as short as possible.
• The PCB layout should be as straight as possible to avoid vias and layer changes. Also, steer clear of right-angle and sharp-angle traces.
• A good reference ground should be set around the PCB traces, and other signal lines should be kept away from the antenna.
• A complete ground is recommended as a reference ground.
• The ground plane around the antenna must reinforce its connection to the main ground plane of the motherboard.
• The distance between the antenna and other mental components should be at least 10 mm.

Antenna metrics

Parameter	Metrics
VSWR	≤ 2
Efficiency	＞ 30%
Input impedance	50Ω
Insertion loss (＜ 1 GHz)	＜ 1 dB
Insertion loss (1 to 2.3 GHz)	＜ 1.5 dB
Insertion loss (＞ 2.3 GHz)	＜ 2.0 dB

Packing and production instructions

Mechanical dimensions

TCS600U is equipped with a total of 106 pins, including 76 leadless chip carrier (LCC) pins and 30 land grid array (LGA) pins.

The dimensions are 21.9 mm±0.35 (W) × 22.9 mm±0.35 (L) × 2.4 mm±0.15 (H), as shown below. The PCB thickness is 0.8 mm±0.1 mm.

Mechanical dimensions

SMT package

Stencil opening design

• Stencil thickness: The stencil thickness of the area for the module should be partly stepped-up within a range from 0.18 mm to 0.2 mm. The stencil thickness in other positions is determined according to product design.
• LCC pins:
  • The stencil openings are shrunk inward by 0.1 mm, and moved outward by 1 mm along the length direction.
  • Along the width direction, the stencil openings are shrunk inward by 0.16 mm (each side by 0.08 mm) with a length of 1.4 mm (module’s lead length, avoiding solder beads), and are moved outward by 0.2 mm (each side by 0.1 mm) with a length of 2 mm (exposed on the areas outside the bottom of the module leads must get increased tinning).
• LGA pins: The total opening area of the stencil should be 60% of the total pad area. If the area of a single opening exceeds 60%, you can set a pitch of 0.3 mm.

Production instructions

1. Package the module with the SMT if Tuya’s module is designed to be SMT-packaged. After being unpacked, the module must be soldered within 24 hours. Otherwise, it needs to be put into a drying cupboard with a relative humidity level no greater than 10%, or pack the module in vacuum again. Then, record the packing time and duration of exposure. The total exposure time cannot exceed 168 hours.

   • Instruments or devices required for the SMT process:
     • Surface mount system
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • AOI
   • Instruments or devices required for the baking process:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. A delivered module must meet the following storage requirements:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • A humidity indicator card (HIC) is put in the sealed package.

     

3. The module needs to be baked in the following cases:

   • The vacuum packaging bag is damaged before unpacking.
   • After unpacking, no HIC is found in the packaging bag.
   • After unpacking, the HIC indicates a humidity level of 10% or higher. In this case, the circle turns pink on the HIC.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the first sealing of the bag.

4. The baking parameter settings are described below:

   • Baking temperature: 40°C for reel packaging with relative humidity ≤ 5%. And 125°C for tray packaging with relative humidity ≤ 5% (use the heat-resistant tray, rather than plastic containers).
   • Baking time: 168 hours for reel packaging and 12 hours for tray packaging.
   • Temperature for triggering an alert: 50°C for reel packaging and 135°C for tray packaging.
   • Production can begin after a module has cooled down to below 36°C under natural conditions.
   • If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked after exposure for more than 168 hours, do not use reflow soldering to solder them. Because these modules are level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, device failure or poor soldering performance might occur.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the pass rate, we recommend that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Perform the SMT process according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: temperature axis

• B: time axis

• C: alloy liquidus temperature from 217°C to 220°C

• D: ramp-up slope from 1°C/s to 3°C/s

• E: keep a constant temperature from 150°C to 200°C for a time period from 60s to 120s

• F: temperature above liquidus temperature for 50s to 70s

• G: peak temperature from 235°C to 245°C

• H: ramp-down slope from 1°C/s to 4°C/s

  The curve above is based on solder paste SAC305. For more information about other solder pastes, see the recommended oven temperature curve in the specified solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Shipping packaging	Modules per reel	Reels per carton
TCS600U	2,800	Tape and reel	700	4