LZ211-EAU Module Datasheet

LZ211-EAU is an LTE Cat.1+GNSS cellular positioning module that Tuya has developed. Built-in with the LTE CaT.1 network communication protocol stack, GNSS protocol, and rich library functions, it consists of a highly integrated LTE Cat.1 chip (UIS8910DM), a GNSS chip (UC6228CI), and a few peripheral circuits.

Product overview

LZ211-EAU has a Cortex A5 processor, a Cat.1bis modem, and a GNSS signal receiver inside and is integrated with 64-MB flash memory and 128-MB SRAM. It supports interfaces including USB, UART, SDIO, SPI, I2C, I2S, and ADC. Besides, it also supports peripherals, such as display screen, camera, keyboard matrix, microphone, speaker, charging, MicroSD card, and USIM card.

Features

• Cortex A5 processor and the clock rate of CPU: 500 MHz
• Supply voltage:
  • Operating voltage: 3.4 to 4.3 V
  • Typical operating voltage: 3.8 V
• SIM card: 1.8V/3V
• Features of LTE Cat.1:
  ­ Frequency band
  • LTE-FDD: B1/B3/B5/B7/B8/B20/B28A
  • LTE-TDD: B38/40/41
  • GSM/GPRS：GSM850/GSM900/DCS1800
• Data rate
  • LTE-FDD: Max 10 Mbit/s (downlink)/Max 5 Mbit/s (uplink)
  • LTE-TDD: Max 8.2 Mbit/s (downlink)/Max 3.4 Mbit/s (uplink)
  • GSM/GPRS: Max 85.6kbps (downlink/Max 42.8kbps (uplink）
• Max Transmit power: LTE :23dBm±2dBm/GSM:33±2dBm/DCS: 30±2dBm
• Receiving sensitivity: Less than LTE: -98dBm/GSM: -108dBm
• Antenna impedance 50Ω, an external antenna required
• Wi-Fi SCAN, support only the indoor positioning
• Features of location engine:
  • 64-channel synchronous track
  • Hot start: ＜1.2s
  • Cold boot sensitivity: -145 dBm, and tracking sensitivity: -158 dBm
  • Data update rate: Max 10 Hz
• Support GPS and BeiDou
  • Use the broad frequency band for RF and the central frequency for input signals is 1575 MHz.
  • Receive and track 1575.42 MHz L1 signals of the GPS
  • Receive and track 1561.098 MHz B1 signals of BeiDou
• Interfaces:
  • 1 USB 2.0
  • 2 UARTs
  • 2 I2Cs
  • 1 PCM/I2S
  • 1 SDIO
  • 1 SPI
  • 3 ADC
  • 1 SPI FLASH
• Peripherals:
  • SPI display screen with the resolution of QVGA 320x240 and 30 FPS
  • SPI/MIPI camera with 300,000 pixels
  • 4*5 keyboard matrix
  • 1 microphone
  • 1 speaker
  • MicroSD card
  • Charging
• Normal working temperature: -30°C to +75℃ ¹
• Extended working temperature: -40°C to +85℃ ²
• Support to upgrade firmware with the OTA technology

Note:
¹ indicates that when the module is in the working temperature range, the performance related to the module meets the 3GPP standard.
² indicates that when the module is in the working temperature range, the module can still work normally, but some RF indicators might slightly exceed the standard values in the 3GPP.

Applications

• Smart health: Drug traceability, remote medical monitoring, blood pressure meter, blood glucose meter, heart armor monitoring, baby monitor, etc.
• Smart city: Smart street lights, smart parking, urban trash can management, public safety alarms, urban environment monitoring (water pollution, noise, air quality PM2.5, etc.)
• Consumers: Wearable devices, bicycles, mopeds anti-theft, smart luggage, VIP tracking (children, elderly, pets and vehicle rental), and payment/POS machines
• Agricultural environment: Precision planting (environment parameters: water, temperature, sunshine, biocide and fertilizer), animal husbandry (health and tracking), aquaculture and food safety traceability
• Logistics warehousing: Asset, container tracking, warehouse management, fleet management tracking, and logistics status tracking.
• Smart building: Access control, smart HVAC, smoke detection, fire detection, and elevator failure/repair
• Manufacturing industry: Production, equipment status monitoring, energy facilities, oil and gas monitoring, chemical park monitoring, large-scale rental equipment, and predictive maintenance (home appliances, machinery, etc.)
• Public utilities: Meter reading (water, gas, and electricity), intelligent water affairs (pipe network, leakage, and quality inspection), smart fire extinguisher, fire hydrant, etc.

Module interfaces

Pin distribution

LZ211-EAU has 144 pins in total. Among them, there are 80 LCC-packaged pins and 64 LGA-packaged pins.

The diagram of correspondence between pin ID and pin name

Pin definition

Pin number	Pin name	Signal type	Description
1	WAKEUP_IN	I	Wakeup pin, used by the external device to wake up the module. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 10
2	AP_READY*	I	Used to detect the status of the processor. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 11.
3	WAKEUP_OUT*	O	Wakeup pin, used by the module to wake up the external device. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 5.
4	W_DISABLE_N*	I	Flight mode. Not connected to anything when it is not used. In OpenCPU mode, it can be used as GPIO 8.
5	NET_MODE	PI	Used to indicate the network registration status. Flashing fast indicates “in the progress of searching for the network”. Flashing slowly indicates “already connected to the Tuya Cloud Platform”.
6	NET_STATUS*	O	Used to indicate the network running status. In OpenCPU mode, it can be used as GPIO 9.
7	VDD_EXT	PO	1.8V. Offer a high level to the external GPIO. Not connected when it is not used.
8	GND	-	Ground
9	GND	-	Ground
10	USIM_GND	-	Ground
11	ISENSE	I	Used to detect the current for charging.
12	VBAT_SENSE	I	Used to detect the voltage of the battery. Try to get close to the positive of the battery as much as possible, and directly connect to the VBAT interface of the module when the battery is not used. Otherwise, the module will keep restarting.
13	USIM_DET	I	Used to detect the hot-swap of the USIM card. Pulled up externally to VDD_EXT when it is used. Not connected to anything when it is not used.
14	USIM_VDD	PO	Working voltage of the USIM card. The module automatically identifies whether the USIM card is 1.8 or 3.0V.
15	USIM_DATA	I/O	Data signal of the USIM card
16	USIM_CLK	O	Clock signal of the USIM card
17	USIM_RST	O	Reset signal of the USIM card
18	VDRV	O	Control signal of the charging circuit
19	GND	-	Ground
20	RESET_N	I	Reset signal, low active
21	PWRKEY	I	Power on or off, low active
22	GND	-	Ground
23	SD_INS_DET	I	Used to detect the SD card. In OpenCPU mode, it can be used as GPIO 7.
24	PCM_DIN	I	Used to input PCM voice data. In OpenCPU mode, it can be used as GPIO 2.
25	PCM_DOUT	O	Used to output PCM voice data. In OpenCPU mode, it can be used as GPIO 3.
26	PCM_SYNC	I/O	PCM voice synchronization signal. In OpenCPU mode, it can be used as GPIO 1.
27	PCM_CLK	I/O	PCM voice clock signal. In OpenCPU, it can be used as GPIO 0.
28	SD_DATA3	I	Data 3 of the SD card. Reuse the Wi-Fi SDIO.
29	SD_DATA2	I	Data 2 of the SD card. Reuse the Wi-Fi SDIO.
30	SD_DATA1	I	Data 1 of the SD card. Reuse the Wi-Fi SDIO.
31	SD_DATA0	I	Data 0 of the SD card. Reuse the Wi-Fi SDIO.
32	SD_CLK	O	Clock signal of the SD card. Reuse the Wi-Fi SDIO.
33	SD_CMD	I/O	Command of the SD card. Reuse the Wi-Fi SDIO.
34	VDD_SDIO	PO	Power supply of the SD card. Reuse the Wi-Fi SDIO.
35	ANT_BT/WIFI	AI/O	Bluetooth and Wi-Fi antenna
36	GND	-	Ground
37	SPI_CS_N	I	SPI chip selection
38	SPI_MOSI	I	SPI MOSI
39	SPI_MISO	O	SPI MISO
40	SPI_CLK	O	Clock signal of the SPI
41	I2C_SCL	OD	Clock signal of the I2C. In OpenCPU mode, it can be used as GPIO 14.
42	I2C_SDA	OD	Data signal of the I2C. In OpenCPU mode, it can be used as GPIO 15.
43	ADC2	AI	Interface 2 for analog-to-digital conversion
44	ADC1	AI	Interface 1 for analog-to-digital conversion
45	ADC0	AI	Interface 0 for analog-to-digital conversion
46	GND	-	Ground
47	ANT_GNSS	AI	GNSS interface of an antenna
48	GND	-	Ground
49	ANT_MAIN	AI/O	Main antenna interface
50 to 54	GND	-	Ground
55	RESERVED	-	Reserved
56	GND	-	Ground
57	VBAT_RF	P	Power supply for the module RF. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 2 A.
58	VBAT_RF	P	Power supply for the module RF. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 2 A.
59	VBAT_BB	P	Power supply for the baseband. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 1 A.
60	VBAT_BB	P	Power supply for the baseband. The voltage ranges from 3.4 to 4.3V. The nominal voltage is 3.8V and the current is 1 A.
61	STATUS*	O	Internally used, not used by the external
62	UART1_RI*	O	Output of ring. In OpenCPU mode, it can be used as GPIO 12.
63	RESERVED63	O	Reserved
64	UART1_CTS	O	UART1: Clean to send. In OpenCPU mode, it can be used as GPIO 18.
65	UART1_RTS	I	UART1: Request to send. In OpenCPU mode, it can be used as GPIO 19.
66	UART1_DTR*	I	UART1: Data terminal ready. It’s the sleep control pin.
67	UART1_TXD	O	UART1: Transmit data. Support the MCU connection.
68	UART1_RXD	I	UART1: Receive data. Support the MCU connection.
69	USB_DP	I/O	USB differential data plus. It supports the module burning and calibration.
70	USB_DM	I/O	USB differential data minus. It supports the module burning and calibration.
71	USB_VBUS	PI	Pin for plug-in detection
72	GND	-	Ground
73	SPK_P	O	Speaker (+)
74	SPK_N	O	Speaker (-)
75	MIC_P	I	Microphone (+)
76	GND	-	Ground
77	MIC_N	I	Microphone (-)
78	KEYIN1	I/O	Key input 1
79	KEYIN2	I/O	Key input 2
80	KEYIN3	I/O	Key input 3
81	KEYIN4	I/O	Key input 4
82	KEYIN5	I/O	Key input 5
83	KEYOUT0	I/O	Key output 0
84	KEYOUT1	I/O	Key output 1
85 to 112	GND	-	Ground
113	KEYOUT2	I/O	Key output 2
114	KEYOUT3	I/O	Key output 3
115	USBBOOT	I/O	If you input 0 through the keyboard and pull the voltage to VDD_EXT before the module is powered on, the module will enter the USB download mode.
116	RESERVED116	-	Reserved. Not connected to anything.
117	CLK26M_OUT	O	The output interface of the clock signal with the frequency of 26 MHz
118	RESERVED118	-	Reserved. Not connected to anything.
119	LCD_FMARK	O	SPI LCD frame alignment signal
120	LCD_RSTB	O	SPI LCD reset signal
121	LCD_SEL	O	SPI LCD selection
122	LCD_CS	O	SPI LCD chip selection
123	LCD_CLK	O	SPI LCD clock signal
124	LCD_SDC	O	SPI LCD selection of data command
125	LCD_SIO	O	SPI LCD serial input/output
126	VDDLCD	P	External LCD power supply
127	PM_ENABLE	O	Enable the external power supply LDO. In OpenCPU mode, it can be used as GPIO 13.
128	VDDCAMA	P	Camera VCAMA power supply
129	CAM_PWDN	IO	Camera CAM_PWDN signal
130	CAM_SI1	I/O	Camera CAM_SI1 signal
131	CAM_SI0	I/O	Camera CAM_SI0 signal
132	CAM_RSTL	I/O	Camera CAM_RSTL signal
133	CAM_REFCLK	O	Camera CAM_REFCLK signal
134	CAM_SCK	IO	Camera CAM_SCK signal
135	UART2_RXD/WAKE_WLAN	O	Serial interface 2, used by the internal GPS, and not open to the external
136	UART2_TXD/WLAN_EN	O	Serial interface 2, used by the internal GPS, and not open to the external
137	UART3_RXD/KEYOUT4	I	Serial interface 3: Receive data and reuse KEYOUT4.
138	UART3_TXD/KEYOUT5	O	The serial interface 3: Transmit data and reuse KEYOUT5.
139	ZSP_UART_TXD/BT_EN	O	Used only by the internal GPS, and not open to the external
140	VDDCAMD	P	Camera VCAMD power supply
141	I2C2_SCL	I/O	I2C clock signal In OpenCPU mode, it can be used as GPIO 16.
142	I2C2_SDA	IO	I2C data signal In OpenCPU mode, it can be used as GPIO 17.
143	DBG_RXD	I	Debugging interface: The pin is used for receiving data.
144	DBG_TXD	O	Debugging interface: The pin is used for transmitting data.

Note: P indicates a power supply pin and I/O indicates an input/output pin. “*” indicates that the function is not supported currently.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	90	℃
VBAT	Supply voltage	-0.3	4.6	V

ESD features

Location	Air charge	Contact charge
GND	±10 KV	±5 KV
Antenna interface	±8KV	±4KV
Other interfaces	±1 KV	±0.5 KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Operating temperature	-30	-	75	℃
Ta	Extended operating temperature	-40	-	85	℃
VBAT	Operating voltage	3.4	3.8	4.3	V

Direct-current parameters

1.8 V Digital I/O

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
VIL	Low level input	-	-	0.3*VCC	V
VIH	High level input	0.7*VCC	-	VCC	V
VOL	Low level output	-	-	0.2*VCC	V
VOH	High level output	0.8*VCC	-	VCC	V

Standby and transmission power consumption:

Working Mode	Condition	Average value	Peak value (Typical value)	Unit
Standby current	LTE-TDD	9.2	-	mA
Standby current	LTE-FDD	8.9	-	mA
Constantly transmit (23 dBm)	LTE-TDD	300	600*	mA
Constantly transmit (23 dBm)	LTE-FDD	550	600*	mA
Constantly transmit (33dBm)	GSM850/900	245	260*	mA
Constantly transmit (30dBm)	DCS1800	180	200*	mA

Note: The 600-mA current is generated when the VBAT is in parallel connected to the 1000-uA capacitor. If there is no large capacitor, the peak current will be above 1A. So please pay attention to the power input.

RF parameters

Basic RF features

Parameter	Description
LTE-FDD frequency band	LTE-FDD:B1/B3/B5/B7/B8/B20/B28A
LTE-TDD frequency band	LTE-TDD: B38/B40/B41
GSM frequency band	GSM850/GSM900/DCS1800
Wireless standard	3GPP R13
LTE-FDD rate	LTE-FDD: Max 10 Mbps (downlink)/max 5 Mbps (uplink)
LTE-TDD rate	LTE-TDD: Max 8.2 Mbps (downlink)/max 3.4 Mbps (uplink)
GSM/GPRS rate	Max 85.6kbps (downlink)/ 42.8kbps (uplink)
Antenna	Characteristic impedance of 50 Ω

TX performance

TX performance

Frequency band	Minimum value	Maximum value	Unit
LTE-FDD B1	＜-39	23±2	dBm
LTE-FDD B3	＜-39	23±2	dBm
LTE-FDD B5	＜-39	23±2	dBm
LTE-FDD B7	＜-39	23±2	dBm
LTE-FDD B8	＜-39	23±2	dBm
LTE-FDD B20	＜-39	23±2	dBm
LTE-FDD B28A	＜-39	23±2	dBm
LTE-TDD B38	＜-39	23±2	dBm
LTE-TDD B40	＜-39	23±2	dBm
LTE-FDD B41	＜-39	23±2	dBm
GSM850	5±5	33±2	dBm
GSM900	5±5	33±2	dBm
DCS1800	0±5	30±2	dBm

RX performance

Receiving sensitivity:

Frequency band	Typical value	Unit
LTE-FDD B1	-98.5	dBm
LTE-FDD B3	-98.5	dBm
LTE-FDD B5	-98	dBm
LTE-FDD B7	-97.5	dBm
LTE-FDD B8	-98.5	dBm
LTE-FDD B20	-97.5	dBm
LTE-FDD B28A	-97.5	dBm
LTE-TDD B38	-98.5	dBm
LTE-TDD B40	-98.5	dBm
LTE-TDD B41	-98.5	dBm
GSM850	-108	dBm
GSM900	-108	dBm
DCS1800	-108.5	dBm

GNSS performance parameters

Parameter	Project conditions	Indicator	Unit
CN0 test value	The signal strength of the stimulator: -130 dBm (AVG)	40±2	dBc
TTFF (static in the open environment)	Cold boot/hot start/recapture	30/1.2/2	s
Sensitivity test	Capture sensitivity/tracking sensitivity	-145/-158	dBm
Positioning precision	CEP50 in the static and open environment	2.5	m
Antenna type	Antenna provided by the third party with the characteristic impedance of 50Ω	–	–

Antenna information

Antenna type

The module does not have its own onboard PCB antenna, and the third party needs to provide an antenna.

The antenna can be an external rod antenna, a spring antenna, an IPEX- FPC antenna, a PCB board antenna, etc. The antenna forms include monopole antenna, PIFA antenna, IFA antenna, loop antenna, etc.

• Rod antenna

  

• FPC antenna

  

• GPS antenna

  The active antenna can be used through the external power supply.

  

• Ceramics GPS antenna

  

Antenna design requirements

• Ensure that the characteristic impedance of the transmission line is 50Ω.
• Since the antenna line loss needs to be less than 0.3 dB, keep the PCB trace as short as possible.
• When designing the layout, you should choose the most direct and shortest route, to prevent from routing through layers or holes, and rectangles and sharp angles.
• There is a good ground reference for the antenna, which stays away from other signal wires.
• It is recommended that you use the complete ground plane as the ground reference.
• Strengthen the connection between the ground around the antenna and the main ground.
• It is recommended that the antenna be at least 10 mm away from other metal parts.

Packaging information and production instructions

Mechanical dimensions

LZ211-EAU has 144 pins in total. Among them, there are 80 LCC-packaged pins and 64 LGA-packaged pins.

The dimensions of LZ211-EAU are 29±0.35 mm (W)×32±0.35 mm (L)×2.4±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

Mechanical dimensions and dimensions of the back of the pad

Note: The tolerance for the length and width of the module is ±0.35 mm, the height is ±0.15 mm, and the thickness is ±0.1 mm.

PCB footprint-SMT

Suggestions on stencil aperture

1. Thickness of stencil: Step stencils are preferred. The thickness of stencils for the module is 0.18-0.2 mm. The thickness of other positions is determined by the product design.
2. Module LCC pin: The length of the stencil opening is 0.1mm inward and 1mm outward; in the width direction is 0.16mm (0.08mm on one side), and the length is 1.4mm (module pin length to prevent tin beads) and 0.2mm outward. (0.1mm on one side), extended length of 2mm (exposed to the area outside the bottom of the module pin, increase the amount of tin).
3. Module LGA pin： The area of aperture is 60% of the area of the soldering pad. If a single aperture is too large, it can be separated by 0.3mm in the middle.

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves
2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:
   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months has passed since the sealing of the bag.
4. Baking settings:
   • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
   • Time: 48 hours for reel package and 12 hours for tray package
   • Alarm temperature: 65°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
5. In the whole production process, take electrostatic discharge (ESD) protective measures.
6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	Modules per reel	Reels per carton
LZ211-EAU	2800	Tape reel	700	4