WBR1D-IPEX Module Datasheet

WBR1D-IPEX is a low-power embedded Wi-Fi module that Tuya has developed. It consists of a highly integrated wireless RF chip (W701D-VA1-CG), a few peripherals, a built-in Wi-Fi network protocol stack, Bluetooth network protocol, and varied library functions.

Overview

WBR1D-IPEX has an embedded low-power 32-bit CPU, 512-KB static random-access memory (SRAM), 4-MB flash memory, and rich peripherals.

WBR1D-IPEX is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/ IP. You can develop embedded Wi-Fi products as required.

The functional block diagram of WBR1D-IPEX is shown below:

Features

• Embedded low-power 32-bit CPU, which can also function as an application processor
• The maximum clock rate: 200 MHz
• Working voltage: 3.3 ±0.3V
• Peripherals: 6 GPIOs, 1 universal asynchronous receiver/transmitter (UART), 1 UART (which can display log information and be used for debugging), and 1 analog-to-digital converter (ADC)
• Wi-Fi connectivity
  • 802.11 a/b/g/n 1x1, 2.4 G&5 G
  • Channels 1 to 14@2.4 GHz; channels 36 to 177@5 GHz
  • Support WEP/WPA/WPA2/WPA2 PSK (AES) WPA3 security mode
  • Up to +17 dBm output power in 802.11b mode; up to +15 dbm output power in 802.11a mode
  • Support STA/AP/STA+AP working mode
  • Support SmartConfig and AP network configuration manners for Android and iOS devices
  • Onboard PCB antenna with a gain of 2 dBi@2.4 G or 2.6 dBi@5 G
  • Working temperature: -20℃ to 85℃
• Bluetooth LE connectivity
  • Support Bluetooth LE V5.0
  • Up to +9 dBm output power
  • PCB antenna with a gain of 2 dBi@2.4 G, which is shared by Wi-Fi and Bluetooth
  • Working temperature: -20℃ to 85℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and footprint

WBR1D-IPEX has two rows of pins with a 1.5±0.1 mm pin spacing.

The WBR1D-IPEX dimensions are 18±0.35 mm (W)×23.5±0.35 mm (L)×2.8±0.15 mm (H).

Diagram of dimensions of WBR1D-IPEX

Pin definition

Pin number	Symbol	I/O type	Function
1	VCC	P	The internal level conversion circuit supplies power to the input pin and the actual voltage is the voltage uploaded by the user’s backplane
2	TX/PB1	I/O	User-side serial interface TXD signal
3	RX/PB2	I/O	User-side serial interface RXD signal
4	3V3	P	Power supply pin (3.3V)
5	GND	P	Power supply reference ground
6	PA12	I/O	Support hardware PWM function and correspond to PA 12 of IC
7	PA13	I/O	Support hardware PWM function and correspond to PA 13 of IC
8	LOGTX	I/O	LOG serial interface output pin (used to display the internal information of the module)
9	PA26	I/O	Common IO pin, which corresponds to PA 26 of IC
10	PA28	I/O	Support hardware PWM function and correspond to PA 28 of IC
11	U0RX	I/O	LOG serial interface input pin
12	PB21	I/O	Common IO pin, which corresponds to PB 21 of IC
13	PA25	I/O	Support hardware PWM function and correspond to PA 25 of IC
14	GND	P	Power supply reference ground
15	GND	P	Power supply reference ground
16	EN	I/O	External reset signal
17	ADC	AI	ADC port
18	GND	P	Power supply reference ground

Note:

• P indicates power supply pins, I/O indicates input/output pins and AI indicates analog input pins.
• RST is only a hardware reset pin and cannot be used for clearing information about Wi-Fi network configuration.

Definitions of test points

Pin aq	Symbol	I/O type	Function
-	TEST	I	Be used for the production test of the module

Note: Test pins are not recommended.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-20	85	℃
VBAT	Power supply voltage	3.0	3.6	V
Static electricity discharge voltage (human body model)	TAMB-25℃	-	2	KV
Static electricity discharge voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	85	℃
VBAT	Power supply voltage	3.0	3.3	3.6	V
VIL	IO low-level input	-0.3	-	VCC*0.25	V
VIH	IO high-level input	VCC*0.75	-	VCC	V
VOL	IO low-level output	-	-	VCC*0.1	V
VOH	IO high-level output	VCC*0.8	-	VCC	V
Imax	IO drive current	-	-	12	mA

TX and RX power consumption

Transmission and receiving at 2.4G

Working Status	Mode	Rate	Transmit Power/Receive	Typical value	Unit
Transmit	11 b	11Mbps	+18dBm	250	mA
Transmit	11g	54Mbps	+17dBm	180	mA
Transmit	11n-HT20	MCS7	+16dBm	170	mA
Transmit	11n-HT40	MCS7	+16dBm	150	mA
Receive	11b	11Mbps	Constantly receive	70	mA
Receive	11g	54Mbps	Constantly receive	72	mA
Receive	11n-HT20	MCS7	Constantly receive	70	mA
Receive	11n-HT40	MCS7	Constantly receive	73	mA

Transmission and receiving at 5G

Working Status	Mode	Rate	Transmit Power/Receive	Typical value	Unit
Transmit	11a	54Mbps	+15dBm	300	mA
Transmit	11n-HT20	MCS7	+15dBm	230	mA
Transmit	11n-HT40	MCS7	+14dBm	220	mA
Receive	11a	54Mbps	Constantly receive	71	mA
Receive	11n-HT20	MCS7	Constantly receive	72	mA
Receive	11n-HT40	MCS7	Constantly receive	76	mA

Working current

Working mode	Working Status, Ta = 25℃	Average value	Maximum value (Typical value)	Unit
	Quick network connection state	The module is in the fast network connection state and the Wi-Fi indicator flashes fast	57	184
Hotspot network configuration state	The module is in the hotspot network configuration state and the Wi-Fi indicator flashes slowly	203	392	mA
Network connection state	The module is connected to the network and the Wi-Fi indicator is always on	55	98	mA
Disconnected state	The module is disconnected and the Wi-Fi indicator is dark	53	59	mA

RF parameters

Basic RF features

Parameter	Description
Working frequency	2.412 to 2.484 GHz; 5.180 to 5.885 GHz
Wi-Fi standard	IEEE 802.11 a/b/g/n (Channels 1 to 14; channels 36 to 177)
Data transmission rate	11b: 1, 2, 5.5, 11 (Mbps) 11 a/g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps) 11n: HT20 MCS 0 to 7, HT40 MCS 0 to 7
Antenna Type	PCB antenna with a gain 2 dBi@2.4 G; PCB antenna with a gain 2.6 dBi@5 G

TX performance

2.4G TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode 11M	-	17	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	16	-	dBm
Average RF output power, 802.11n HT20 Mode MCS7	-	15	-	dBm
Average RF output power, 802.11n HT40 Mode MCS7	-	14	-	dBm
Frequency error	-10	-	10	ppm

5G-TX Performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11a OFDM Mode 54M	-	15	-	dBm
Average RF output power, 802.11n HT20 Mode MCS7	-	14	-	dBm
Average RF output power, 802.11n HT40 Mode MCS7	-	13	-	dBm
Frequency error	-10	-	10	ppm

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 11M	-	-91	-	dBm
PER<10%, RX sensitivity, 802.11a/g OFDM Mode 54M	-	-75	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode HT20-MCS7	-	-72	-	dBm

Antenna

Antenna type

WBR1D-IPEX uses only an Ipex antenna.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To ensure the antenna performance, the PCB should not be routed or clad with copper in the antenna area. The main points of the layout: 1. Make sure that there is no substrate medium directly below or above the printed antenna. 2. Make sure that the area around the printed antenna is far away from the metal copper skin, so as to ensure the radiation effect of the antenna to the greatest extent.

For the antenna area of the PCB of the module, refer to the Diagram of Mechanical Dimensions.

Power-on sequence and resetting

Power-on sequence

The RTL8720DN chip has requirements on the power-on sequence. It is recommended that the voltage rises from 0 to 3.3V within 40mS.

Symbol	Parameter	Minimum	Typical	Maximum	Unit
TPRDY	3.3V ready time	0.6		40	mS
CHIP_EN	CHIP_EN ready time	0.6		40	mS

Resetting

When designing a plate of a module, you should reserve a reset IC on the pin CHIP_EN. The preferable type of IC is BL8506-27CRO. The IC is packaged in the form of SOT23. Refer to the circuit in the following figure (R30 is reserved and may not be mounted).

Treatment of pin GPIO

A few pins (PA 12, PA 13, PA 15, PA 25, PA 28, and PA 26) of the module will have instantaneous high-level pulses before the chip fully works, and everything will be normal after the chip works. For these pins, if they are directly used as driving light sources or relays, in order to avoid the effect of burrs at the moment of power-on, refer to the following processing:

Pull down a 1K resistor at an output port of a pin, and then connect a diode in series. In this case, the voltage of a GPIO will drop to about 2.7V after passing through the diode. The red box represents the original drive tube on the customer’s baseboard. A diode D1 and pull-down 1-KΩ resistor need to be added.

If a lamp is directly driven, pull down a 10-KΩ resistor on the grid of the positive MOS. If a lamp is not directly driven and a PWM signal will not be sent until the module is officially launched, there is no need to add a pull-down resistor and diode.

If a relay is driven, you can change the diode to a resistor of 0 Ω according to the actual situation.

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 18±0.35 mm(W)×23.5±0.35 mm(L)×0.8 ±0.1mm (H)
g)g)

Side view

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

Schematic diagram of packaging

The Diagram of PCB package

Optionally, WBR1D-IPEX can use SMT.

PCB package diagram-SMT

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product Number	MOQ (pcs)	Shipping packaging method	The number of modules per reel	The number of reels per carton
WBR1D-IPEX	4000	Tape reel	1000	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device to an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except by following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WBR1D-IPEX. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WBR1D-IPEX”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm from the human body.