WBRG1 Module Datasheet

Last Updated on : 2022-08-08 09:33:00download

WBRG1 is a low-power embedded Wi-Fi+Bluetooth module that Tuya has developed. It consists of a highly integrated wireless RF chip (RTL8721CSM) and an external flash chip, with an embedded Wi-Fi network protocol stack and varied library functions.

Overview

With the maximum CPU clock rate of 200 MHz, WBRG1 also contains a KM4 microcontroller unit (MCU), a low-power KM0 MCU, a WLAN MAC, a 1T1R WLAN module, a 4-MB pseudo-static random-access memory (PSRAM), 8-MB flash memory, and rich extensive peripherals.

WBRG1 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power 32-bit Cortex-M33 CPU, which can also function as an application processor
  • The maximum clock rate: 200 MHz
  • Working voltage: 3.0V to 3.6V
  • Peripherals: 6 PWMs, 3 UARTs, 1 I2C, 1 packet traffic arbitration (PTA), and 1 audio
  • Wi-Fi/BT connectivity
    • 802.11 b/g/n20/n40
    • Channels 1 to 14@2.4 GHz (H 1 to 11 for US/CA, and CH 1 to 13 for EU/CN)
    • Support WEP, WPA, WPA2, and WPA2 PSK (AES) security modes
    • Support Bluetooth (Bluetooth Low Energy) 5.0
    • Up to + 20dBm output power in 802.11b mode
    • Support SmartConfig and AP network configuration modes for Android and IOS devices
    • Onboard PC antenna and external antenna IPEX connector
    • Working temperature: -20℃ to 85℃

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Module interfaces

Dimensions and package

WBRG1 has 3 lines of pins with a pin spacing of 1.5 mm.
As shown in the following figures, the dimensions of WBRG1 are 19±0.35 mm (W)×25.7±0.35 mm (L) ×2.9±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

WBRG1 Module Datasheet

Pin definition

Symbol I/O type Function
RTS0 I/O PA 16, which corresponds to Pin 29 and is a serial port Uart0 flow control request-to-send pin
RX0 I/O PA 19, which corresponds to Pin 32 and Uart0_RX and is the docking serial port of a user’s MCU
PA28 I/O PA 28, which corresponds to Pin 38, is a hardware PWM and can be configured as a GPIO
I2C_SCL I/O PB 5, which corresponds to Pin 45 and can be configured as an I2C or GPIO
I2C_SDA I/O PB 6, which corresponds to Pin 46 and can be configured as an I2C or GPIO
PB7 I/O PB7, which corresponds to Pin 47, is a hardware PWM and can be configured as a GPIO
PB4 I/O PB4, which corresponds to Pin 44, is a hardware PWM and can be configured as a GPIO
EN P Enabling pin, which works at the voltage of 3.3V and is pulled up
GND P Power supply reference ground
PRI I/O PB1, which corresponds to Pin 41 and has the PTA_PRI function
REQ I/O PA26, which corresponds to Pin 39 and has the PTA_REQ function
GNT I/O PA27, which corresponds to Pin 33 and has the PTA_GNT function
TX0 I/O PA18, which corresponds to Pin 31 and Uart0_TX and is the docking serial port of a user’s MCU
CTS0 I/O PA17, which corresponds to Pin 30 and is a serial port Uart0 flow control clear-to-send pin
RX1 I/O PA13, which corresponds to Pin 26 and Uart1_RX and is the docking serial port of a user’s MCU
TX1 I/O PA12, which corresponds to Pin 25 and Uart1_TX and is the docking serial port of a user’s MCU
3V3 P Power supply pin (3.3V)
PA25 I/O PA 25, which corresponds to Pin 40, is a hardware PWM and can be configured as a GPIO
PB22 I/O PB 22, which corresponds to Pin 60, is a hardware PWM and can be configured as a GPIO
AOUTP_L I/O PB31, which corresponds to Pin 65, audio’s analog output positive electrode (left channel)
MIC GND I/O MIC_GND
MIC1_P I/O PA4, which corresponds to Pin 3, the input positive electrode of MIC1, main MIC
Log TX I/O PA7, which corresponds to Pin 7 and is used to print system logs
Log Rx I/O PA8, which corresponds to Pin8 and is used to print system logs
PB23 I/O PB23, which corresponds to Pin 61, is a hardware PWM and can be configured as a GPIO

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 105
VBAT Power supply voltage -0.3 3.6 V
ESD voltage (human body model) TAMB-25℃ - 2 KV
ESD voltage (machine model) TAMB-25℃ - 0.5 KV

Normal working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 85
VCC Power supply voltage 3.0 3.3 3.6 V
VIL I/O low level input - - 0.8
VIH I/O high-level input 2.0 - - V
VOL I/O low level output - - 0.4 V
VOH I/O high level output 2.4 - -
Imax I/O drive current - - 16 mA
Cpad Input pin capacitance - 2 - mA

TX power consumption

Symbol Mode Power Average value Peak value (Typical value) Unit
IRF 11b 11Mbps 17 dBm 247 272 mA
IRF 11b 11Mbps 18 dBm 252 285 mA
IRF 11g 54Mbps 15 dBm 177 238 mA
IRF 11g 54Mbps 17.5 dBm 202 280 mA
IRF 11n BW20 MCS7 13 dBm 165 240 mA
IRF 11n BW20 MCS7 16.5 dBm 192 269 mA
IRF 11n BW40 MCS7 13 dBm 144 236 mA
IRF 11n BW40 MCS7 16.5 dBm 166 266 mA

RX power consumption

Symbol Mode Average Value Peak Value (Typical Value) Unit
IRF 11B 11M 61 77 mA
IRF 11G 54M 61 75 mA
IRF 11N HT20 MCS7 61 77 mA

Power consumption in working mode

Working mode Working status, TA = 25°C Average value Peak value (Typical value) Unit
Quick network connection state (Bluetooth ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 57 284 mA
Quick network connection state (AP) The module is in the fast network connection state and the Wi-Fi indicator flashes slowly 203 392 mA
Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 55 298 mA
Idle state The module is connected to the network and the- indicator is always on 53 259 mA
Operation state The module is connected to the network and the WiFi indicator is always on 56 293 mA
Disconnected state The module is disconnected 58 287 mA

Note: The above parameters vary with firmware functions.

RF parameters

Basic RF features

Parameter Description
Frequency range 2.400 to 2.4835 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth standard Bluetooth 5.0
Data transmission rate 11b: 1, 2, 5.5, and 11 (Mbps)
Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps)
Data transmission rate 11n: HT20 MCS 0 to 7
Data transmission rate 11n: HT40 MCS 0 to 7
Antenna type PCB antenna with a gain of 1.05 dBi

TX performance

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode 11M - 17.5 - dBm
Average RF output power, 802.11g OFDM Mode 54M - 14.5 - dBm
Average RF output power, 802.11n HT20 Mode MCS7 - 13.5 - dBm
Average RF output power, 802.11n HT40 Mode MCS7 - 13.5 - dBm
Average RF output power, Bluetooth 5.0 - 6.5 - dBm
Frequency error -20 - 20 ppm
EVM@802.11b CCK 11 Mbps Mode 17.5 dBm - - -10 dB
EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm - - -29 dB
EVM@802.11n OFDM MCS7 Mode 13.5 dBm - - -30 dB

RX performance

RX sensitivity

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M - -97 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -76 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -73 - dBm

Antenna

Antenna type

WBRG1 supports two types of antennas: onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

WBRG1 Module Datasheet

WBRG1 Module Datasheet

U.FL RF connector

Parameters of the U.FL RF connector are as below:

WBRG1 Module Datasheet

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 19±0.35 mm (W)×25.7±0.35 mm (L) ×0.8±0.1 mm (H).

WBRG1 Module Datasheet

Note: For the PCB frame, the dimensional tolerance is ±0.35 mm, and for the thickness of the PCB, the dimensional tolerance is ±0.1 mm.

The diagram of PCB packaging

WBRG1 Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:

    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      WBRG1 Module Datasheet

  3. The module needs to be baked in the following cases:

    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:

    • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
    • Time: 168 hours for reel package and 12 hours for tray package
    • Alarm temperature: 50°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.

  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

WBRG1 Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

WBRG1 Module Datasheet

MOQ and packaging information

Product model MOQ (pcs) Packing method The number of modules per reel The number of reels per carton
WBRG1 3600 Tape reel 900 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WBRG1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WBRG1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

WBRG1 Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

WBRG1 Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.