WBRG1 Module Datasheet

WBRG1 is a low-power embedded Wi-Fi+Bluetooth module that Tuya has developed. It consists of a highly integrated wireless RF chip (RTL8721CSM) and an external flash chip, with an embedded Wi-Fi network protocol stack and varied library functions.

Overview

With the maximum CPU clock rate of 200 MHz, WBRG1 also contains a KM4 microcontroller unit (MCU), a low-power KM0 MCU, a WLAN MAC, a 1T1R WLAN module, a 4-MB pseudo-static random-access memory (PSRAM), 8-MB flash memory, and rich extensive peripherals.

WBRG1 is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP. You can develop embedded Wi-Fi products as required.

Features

• Embedded low-power 32-bit Cortex-M33 CPU, which can also function as an application processor
• The maximum clock rate: 200 MHz
• Working voltage: 3.0V to 3.6V
• Peripherals: 6 PWMs, 3 UARTs, 1 I2C, 1 packet traffic arbitration (PTA), and 1 audio
• Wi-Fi/BT connectivity
  • 802.11 b/g/n20/n40
  • Channels 1 to 14@2.4 GHz (H 1 to 11 for US/CA, and CH 1 to 13 for EU/CN)
  • Support WEP, WPA, WPA2, and WPA2 PSK (AES) security modes
  • Support Bluetooth (Bluetooth Low Energy) 5.0
  • Up to + 20dBm output power in 802.11b mode
  • Support SmartConfig and AP network configuration modes for Android and IOS devices
  • Onboard PC antenna and external antenna IPEX connector
  • Working temperature: -20℃ to 85℃

Applications

• Intelligent building
• Smart household and home appliances
• Smart socket and light
• Industrial wireless control
• Baby monitor
• Network camera
• Intelligent bus

Module interfaces

Dimensions and package

WBRG1 has 3 lines of pins with a pin spacing of 1.5 mm.
As shown in the following figures, the dimensions of WBRG1 are 19±0.35 mm (W)×25.7±0.35 mm (L) ×2.9±0.15 mm (H). The thickness of the PCB is 0.8±0.1 mm.

Pin definition

Symbol	I/O type	Function
RTS0	I/O	PA 16, which corresponds to Pin 29 and is a serial port Uart0 flow control request-to-send pin
RX0	I/O	PA 19, which corresponds to Pin 32 and Uart0_RX and is the docking serial port of a user’s MCU
PA28	I/O	PA 28, which corresponds to Pin 38, is a hardware PWM and can be configured as a GPIO
I2C_SCL	I/O	PB 5, which corresponds to Pin 45 and can be configured as an I2C or GPIO
I2C_SDA	I/O	PB 6, which corresponds to Pin 46 and can be configured as an I2C or GPIO
PB7	I/O	PB7, which corresponds to Pin 47, is a hardware PWM and can be configured as a GPIO
PB4	I/O	PB4, which corresponds to Pin 44, is a hardware PWM and can be configured as a GPIO
EN	P	Enabling pin, which works at the voltage of 3.3V and is pulled up
GND	P	Power supply reference ground
PRI	I/O	PB1, which corresponds to Pin 41 and has the PTA_PRI function
REQ	I/O	PA26, which corresponds to Pin 39 and has the PTA_REQ function
GNT	I/O	PA27, which corresponds to Pin 33 and has the PTA_GNT function
TX0	I/O	PA18, which corresponds to Pin 31 and Uart0_TX and is the docking serial port of a user’s MCU
CTS0	I/O	PA17, which corresponds to Pin 30 and is a serial port Uart0 flow control clear-to-send pin
RX1	I/O	PA13, which corresponds to Pin 26 and Uart1_RX and is the docking serial port of a user’s MCU
TX1	I/O	PA12, which corresponds to Pin 25 and Uart1_TX and is the docking serial port of a user’s MCU
3V3	P	Power supply pin (3.3V)
PA25	I/O	PA 25, which corresponds to Pin 40, is a hardware PWM and can be configured as a GPIO
PB22	I/O	PB 22, which corresponds to Pin 60, is a hardware PWM and can be configured as a GPIO
AOUTP_L	I/O	PB31, which corresponds to Pin 65, audio’s analog output positive electrode (left channel)
MIC GND	I/O	MIC_GND
MIC1_P	I/O	PA4, which corresponds to Pin 3, the input positive electrode of MIC1, main MIC
Log TX	I/O	PA7, which corresponds to Pin 7 and is used to print system logs
Log Rx	I/O	PA8, which corresponds to Pin8 and is used to print system logs
PB23	I/O	PB23, which corresponds to Pin 61, is a hardware PWM and can be configured as a GPIO

Note: P indicates a power supply pin and I/O indicates an input/output pin.

Electrical parameters

Absolute electrical parameters

Parameter	Description	Minimum value	Maximum value	Unit
Ts	Storage temperature	-40	105	℃
VBAT	Power supply voltage	-0.3	3.6	V
ESD voltage (human body model)	TAMB-25℃	-	2	KV
ESD voltage (machine model)	TAMB-25℃	-	0.5	KV

Normal working conditions

Parameter	Description	Minimum value	Typical value	Maximum value	Unit
Ta	Working temperature	-20	-	85	℃
VCC	Power supply voltage	3.0	3.3	3.6	V
VIL	I/O low level input	-		-	0.8
VIH	I/O high-level input	2.0	-	-	V
VOL	I/O low level output	-	-	0.4	V
VOH	I/O high level output	2.4	-	-
Imax	I/O drive current	-	-	16	mA
Cpad	Input pin capacitance	-	2	-	mA

TX power consumption

Symbol	Mode	Power	Average value	Peak value (Typical value)	Unit
IRF	11b 11Mbps	17 dBm	247	272	mA
IRF	11b 11Mbps	18 dBm	252	285	mA
IRF	11g 54Mbps	15 dBm	177	238	mA
IRF	11g 54Mbps	17.5 dBm	202	280	mA
IRF	11n BW20 MCS7	13 dBm	165	240	mA
IRF	11n BW20 MCS7	16.5 dBm	192	269	mA
IRF	11n BW40 MCS7	13 dBm	144	236	mA
IRF	11n BW40 MCS7	16.5 dBm	166	266	mA

RX power consumption

Symbol	Mode	Average Value	Peak Value (Typical Value)	Unit
IRF	11B 11M	61	77	mA
IRF	11G 54M	61	75	mA
IRF	11N HT20 MCS7	61	77	mA

Power consumption in working mode

Working mode	Working status, TA = 25°C	Average value	Peak value (Typical value)	Unit
Quick network connection state (Bluetooth )	The module is in the fast network connection state and the Wi-Fi indicator flashes fast	57	284	mA
Quick network connection state (AP)	The module is in the fast network connection state and the Wi-Fi indicator flashes slowly	203	392	mA
Quick network connection state (EZ)	The module is in the fast network connection state and the Wi-Fi indicator flashes fast	55	298	mA
Idle state	The module is connected to the network and the- indicator is always on	53	259	mA
Operation state	The module is connected to the network and the WiFi indicator is always on	56	293	mA
Disconnected state	The module is disconnected	58	287	mA

Note: The above parameters vary with firmware functions.

RF parameters

Basic RF features

Parameter	Description
Frequency range	2.400 to 2.4835 GHz
Wi-Fi standard	IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth standard	Bluetooth 5.0
Data transmission rate	11b: 1, 2, 5.5, and 11 (Mbps)
Data transmission rate	11g: 6, 9, 12, 18, 24, 36, 48, and 54 (Mbps)
Data transmission rate	11n: HT20 MCS 0 to 7
Data transmission rate	11n: HT40 MCS 0 to 7
Antenna type	PCB antenna with a gain of 1.05 dBi

TX performance

TX performance

Parameter	Minimum value	Typical value	Maximum value	Unit
Average RF output power, 802.11b CCK Mode 11M	-	17.5	-	dBm
Average RF output power, 802.11g OFDM Mode 54M	-	14.5	-	dBm
Average RF output power, 802.11n HT20 Mode MCS7	-	13.5	-	dBm
Average RF output power, 802.11n HT40 Mode MCS7	-	13.5	-	dBm
Average RF output power, Bluetooth 5.0	-	6.5	-	dBm
Frequency error	-20	-	20	ppm
EVM@802.11b CCK 11 Mbps Mode 17.5 dBm	-	-	-10	dB
EVM@802.11g OFDM 54 Mbps Mode 14.5 dBm	-	-	-29	dB
EVM@802.11n OFDM MCS7 Mode 13.5 dBm	-	-	-30	dB

RX performance

RX sensitivity

Parameter	Minimum value	Typical value	Maximum value	Unit
PER<8%, RX sensitivity, 802.11b DSSS Mode 1M	-	-97	-	dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M	-	-76	-	dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7	-	-73	-	dBm

Antenna

Antenna type

WBRG1 supports two types of antennas: onboard PCB antenna and external antenna. By default, the onboard PCB antenna is preferred.

Antenna interference reduction

To ensure optimal Wi-Fi performance when the Wi-Fi module uses an onboard PCB antenna, it is recommended that the antenna be at least 15 mm away from other metal parts.

To prevent an adverse impact on the antenna radiation performance, avoid copper or traces along the antenna area on the PCB.

U.FL RF connector

Parameters of the U.FL RF connector are as below:

Power-on/off sequence

Power-on sequence

RTL8721CSM chip has requirements on the power-on sequence. It is recommended that the voltage rises from 0 to 3.3V within 20 ms.

Power-off sequence

Symbol	Parameter	Minimum value	Typical value	Maximum value	Unit
TPRDY	3.3V ready time	0.6	-	20	ms
CHIP_EN	CHIP_EN ready time	0.6	-	20	ms
VBOR	BOR occurs after 3.3V is lower than this voltage	2	-	-	V
TRST	The required time that 3.3V is lower than VBOR	1	-	-	ms

Packaging information and production instructions

Mechanical dimensions

The PCB dimensions are 19±0.35 mm (W)×25.7±0.35 mm (L) ×0.8±0.1 mm (H).

Note: For the PCB frame, the dimensional tolerance is ±0.35 mm, and for the thickness of the PCB, the dimensional tolerance is ±0.1 mm.

The diagram of PCB packaging

Production instructions

1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).

   • SMT devices:
     • Mounter
     • SPI
     • Reflow soldering machine
     • Thermal profiler
     • Automated optical inspection (AOI) equipment
   • Baking devices:
     • Cabinet oven
     • Anti-electrostatic and heat-resistant trays
     • Anti-electrostatic and heat-resistant gloves

2. Storage conditions for a delivered module:

   • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

   • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

   • There is a humidity indicator card (HIC) in the packaging bag.

     

3. The module needs to be baked in the following cases:

   • The packaging bag is damaged before unpacking.
   • There is no HIC in the packaging bag.
   • After unpacking, circles of 10% and above on the HIC become pink.
   • The total exposure time has lasted for over 168 hours since unpacking.
   • More than 12 months have passed since the sealing of the bag.

4. Baking settings:

   • Temperature: 40°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than a plastic container)
   • Time: 168 hours for reel package and 12 hours for tray package
   • Alarm temperature: 50°C for reel package and 135°C for tray package
   • Production-ready temperature after natural cooling: < 36°C
   • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
   • If a batch of modules is not baked within 168 hours, do not use the wave soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.

5. In the whole production process, take electrostatic discharge (ESD) protective measures.

6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

• A: Temperature axis

• B: Time axis

• C: Liquidus temperature: 217 to 220°C

• D: Ramp-up slope: 1 to 3°C/s

• E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

• F: Duration above the liquidus: 50 to 70s

• G: Peak temperature: 235 to 245°C

• H: Ramp-down slope: 1 to 4°C/s

  Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

MOQ and packaging information

Product model	MOQ (pcs)	Packing method	The number of modules per reel	The number of reels per carton
WBRG1	3600	Tape reel	900	4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.
• Increase the separation between the device and receiver.
• Connect the device into an outlet on a circuit different from that to which the receiver is connected.
• Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operate simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WBRG1. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WBRG1”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.