WBR1-IPEX Module Datasheet

Last Updated on : 2022-04-25 02:16:00download

WBR1-IPEX is a low-power embedded Wi-Fi and Bluetooth module that Tuya has developed. It consists of a highly integrated wireless RF chip (W701-VA2-CG), with an embedded Wi-Fi network protocol stack and varied library functions.

Overview

With the maximum CPU clock rate of 100MHz, WBR1-IPEX also contains a low-power KM4 microcontroller unit (MCU), a WLAN MAC, a 1T1R WLAN module, 256 KB static random-access memory (SRAM), 2-MB flash memory, and extensive peripherals.

WBR1-IPEX is an RTOS platform that integrates all function libraries of the Wi-Fi MAC and TCP/IP protocols. You can develop embedded Wi-Fi products as required.

Features

  • Embedded low-power KM4 MCU, which can also function as an application processor; Clock rate: 100MHz

  • Working voltage: 3.0 to 3.6 V

  • Peripherals: 7 GPIOs, 2 universal asynchronous receiver/transmitters

  • Wi-Fi/Bluetooth connectivity

    • 802.11 B/G/N20
    • Channels 1 to 14 at 2.4 Ghz (channels 1 to 11 for US/CA and channels 1 to 13 for EU/CN)
    • Support Bluetooth (Bluetooth Low Energy) 4.2
    • Support WEP/WPA/WPA2/WPA2 PSK (AES) security modes
    • Up to +20 dBm output power in 802.11b mode
    • Support SmartConfig functions for Android and iOS devices
    • IPEX FPC antenna
    • Passed CE and FCC certification
    • Working temperature: -20°C to +85°C

Applications

  • Intelligent building
  • Smart household and home appliances
  • Smart socket and light
  • Industrial wireless control
  • Baby monitor
  • Network camera
  • Intelligent bus

Change history

Update Date Updated Content Version after Update
10/21/2019 This is the first release. V1.0.0

Module interfaces

Dimensions and footprint

WBR1-IPEX has two rows of pins with a 1.5 mm pin spacing. Each row has 9 pins. The WBR1-IPEX dimensions are 18±0.35 mm (W)×23.5±0.35 mm (L) ×2.9±0.15 mm (H). The dimensions of WBR1-IPEX are shown as follows:

WBR1-IPEX Module Datasheet

Pin definition

The definitions of interface pins are shown in the following table:

Pin Number Symbol I/O Type Function
1 Vin P UART_TX, Power supply conversion (5V or 3.3V)
2 TX I/O GPIOA_14, UART_TX, which is used as a user-side serial interface pin
3 RX I/O GPIOA_13, UART_RX, which is used as a user-side serial interface pin
4 3V3 P Power supply pin (3.3V)
5 GND P Power supply reference ground
6 A_2 I/O GPIOA_2, hardware PWM, IC Pin 18
7 A_3 I/O GPIOA_3, hardware PWM, IC Pin 19
8 Log_Tx P GPIOA_16, UART_Log_TXD, which is used for displaying the module internal information and can be configured as a common GPIO
9 A_4 I/O GPIOA_4, hardware PWM, IC Pin 20
10 A_11 I/O GPIOA_11, hardware PWM, IC Pin 25
11 Log_Rx I/O GPIOA_15, UART_Log_RXD, which is used for displaying the module internal information and can be configured as a common GPIO
12 A_12 I/O GPIOA_12, hardware PWM,IC Pin 26
13 A_17 I/O GPIOA_17,hardware PWM,IC Pin 38
14 GND P Power supply reference ground
15 GND P Power supply reference ground
16 EN I/O Enabling pin, which works at the high level and is pulled up and controlled by a user externally
17 A_18 I/O GPIOA_18, hardware PWM,IC Pin 39
18 GND P Power supply reference ground

Note: P indicates power supply pins and I/O indicates input/output pins.

Electrical parameters

Absolute electrical parameters

Parameter Description Minimum value Maximum value Unit
Ts Storage temperature -40 105
VDD Power supply voltage -0.3 3.6 V
Static electricity discharge voltage (human body model) TAMB-25℃ - 2 KV
Static electricity discharge voltage (machine model) TAMB-25℃ - 0.5 KV

Working conditions

Parameter Description Minimum value Typical value Maximum value Unit
Ta Working temperature -20 - 85
VDD Working voltage 3.0 - 3.6 V
VIL I/O low-level input - - 0.8 V
VIH I/O high-level input 2.0 - - V
VOL I/O low-level output - - 0.4 V
VOH I/O high-level output 2.4 - - V
Imax I/O drive current - - 16 mA
Cpad Input pin capacitance - 2 - pF

RF power consumption

TX power consumption:

Symbol Mode Power Average value Peak value (Typical value) Unit
IRF 11b 11Mbps 17dBm 217 268 mA
IRF 11b 11Mbps 18dBm 231 283 mA
IRF 11g 54Mbps 15dBm 159 188 mA
IRF 11g 54Mbps 17.5dBm 177 213 mA
IRF 11n BW20 MCS7 13dBm 145 167 mA
IRF 11n BW20 MCS7 16.5dBm 165 193 mA

RX power consumption:

Symbol Mode Average value Peak value (Typical value) Unit
IRF 11B 11M 63 65 mA
IRF 11G 54M 65 67 mA
IRF 11N HT20 MCS7 65 67 mA

Working power consumption

Working mode Working status, Ta = 25°C Average value Maximum value (Typical value) Unit
Quick network connection state (Bluetooth) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 61 272 mA
Quick network connection state (AP) The module is in the hotspot network connection state and the Wi-Fi indicator flashes slowly 59 272 mA
Quick network connection state (EZ) The module is in the fast network connection state and the Wi-Fi indicator flashes fast 62 280 mA
No operation during network connection The module is connected to the network and the Wi-Fi indicator is always on 51 260 mA
Operations are being performed during network connection The module is connected to the network and the Wi-Fi indicator is always on 59 268 mA
Weakly connected The module and the hotspot are weakly connected and the Wi-Fi indicator light is always on 62 264 mA
Disconnected The module is in disconnected state and the Wi-Fi indicator light is always off 57 268 mA
Module disabled The EN pin of the module is connected to the ground. 1.5 1.6 uA

RF parameters

Basic RF features

Parameter Description
Frequency range 2.400 to 2.4835 GHz
Wi-Fi standard IEEE 802.11b/g/n (channels 1 to 14)
Bluetooth standard Bluetooth 4.2
Data transmission rate 11B:1, 2, 5.5, 11 (Mbps)
Data transmission rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 (Mbps)
Data transmission rate 11n: HT20 MCS 0 to 7
Antenna Type Antenna to which a U.FL RF connector is externally connected

TX performance

Parameter Minimum value Typical value Maximum value Unit
Average RF output power, 802.11b CCK Mode, 1 Mbit/s - 17.5 - dBm
Average RF output power, 802.11g OFDM mode, 54 Mbit/s - 14.5 - dBm
Average RF output power, 802.11n OFDM mode, MCS7 - 13.5 - dBm
Average RF output power, Bluetooth 4.2, 1 Mbit/s - 6.5 - dBm
Frequency error -20 - 20 ppm
EVM@802.11b CCK 11Mbps Mode 17.5dBm - - -10 dB
EVM@802.11g OFDM 54Mbps Mode 14.5dBm - - -29 dB
EVM@802.11n OFDM MCS7 Mode 13.5dBm - - -30 dB

RX performance

Parameter Minimum value Typical value Maximum value Unit
PER<8%, RX sensitivity, 802.11b CCK Mode 1M - -97 - dBm
PER<10%, RX sensitivity, 802.11g OFDM Mode 54M - -75 - dBm
PER<10%, RX sensitivity, 802.11n OFDM Mode MCS7 - -72 - dBm
PER<10%, RX sensitivity, Bluetooth 4.2 1M - -93 - dBm

Antenna

Antenna type

You can select external FPC antenna by configuring a resistor.

WBR1-IPEX Module Datasheet

Antenna interference reduction

To ensure optimal Wi-Fi performance , it is recommended that the antenna be at least 15 mm away from other metal parts.

Antenna connector specifications

WBR1-IPEX Module Datasheet

Power-on sequence and resetting

Packaging information and production instructions

Mechanical dimensions

The mechanical dimensions of the PCB of WBR1-IPEX are 18±0.35 mm (W)×23.5±0.35 mm (L) ×0.8±0.1 mm (H). The following figure shows the mechanical dimensions of WBR1-IPEX.

WBR1-IPEX Module Datasheet

WBR1-IPEX Module Datasheet

Note: The default dimensional tolerance is ±0.35 mm. If you have specific requirements on dimensions, make them clear in the datasheet after communication.

Recommended PCB layout

The following figure is a schematic diagram of WBR1-IPEX which shows how pins correspond to each other.

WBR1-IPEX Module Datasheet

WBR1-IPEX PCB Layout is shown as below:

WBR1-IPEX Module Datasheet

Production instructions

  1. The Tuya SMT module should be mounted by the SMT device. After being unpacked, it should be soldered within 24 hours. Otherwise, it should be put into the drying cupboard where the RH is not greater than 10%; or it needs to be packaged under vacuum again and the exposure time needs to be recorded (the total exposure time cannot exceed 168 hours).
    • SMT devices:
      • Mounter
      • SPI
      • Reflow soldering machine
      • Thermal profiler
      • Automated optical inspection (AOI) equipment
    • Baking devices:
      • Cabinet oven
      • Anti-electrostatic and heat-resistant trays
      • Anti-electrostatic and heat-resistant gloves
  2. Storage conditions for a delivered module:
    • The moisture-proof bag must be placed in an environment where the temperature is below 40°C and the relative humidity is lower than 90%.

    • The shelf life of a dry-packaged product is 12 months from the date when the product is packaged and sealed.

    • There is a humidity indicator card (HIC) in the packaging bag.

      WBR1-IPEX Module Datasheet

  3. The module needs to be baked in the following cases:
    • The packaging bag is damaged before unpacking.
    • There is no HIC in the packaging bag.
    • After unpacking, circles of 10% and above on the HIC become pink.
    • The total exposure time has lasted for over 168 hours since unpacking.
    • More than 12 months have passed since the sealing of the bag.
  4. Baking settings:
    • Temperature: 60°C and ≤ 5% RH for reel package and 125°C and ≤5% RH for tray package (please use the heat-resistant tray rather than plastic container)
    • Time: 48 hours for reel package and 12 hours for tray package
    • Alarm temperature: 65°C for reel package and 135°C for tray package
    • Production-ready temperature after natural cooling: < 36°C
    • Re-baking situation: If a module remains unused for over 168 hours after being baked, it needs to be baked again.
    • If a batch of modules is not baked within 168 hours, do not use the reflow soldering to solder them. Because these modules are Level-3 moisture-sensitive devices, they are very likely to get damp when exposed beyond the allowable time. In this case, if they are soldered at high temperatures, it may result in device failure or poor soldering.
  5. In the whole production process, take electrostatic discharge (ESD) protective measures.
  6. To guarantee the passing rate, it is recommended that you use the SPI and AOI to monitor the quality of solder paste printing and mounting.

Recommended oven temperature curve

Set oven temperatures according to the following temperature curve of reflow soldering. The peak temperature is 245°C.

WBR1-IPEX Module Datasheet

  • A: Temperature axis

  • B: Time axis

  • C: Liquidus temperature: 217 to 220°C

  • D: Ramp-up slope: 1 to 3°C/s

  • E: Duration of constant temperature: 60 to 120s; the range of constant temperature: 150 to 200°C

  • F: Duration above the liquidus: 50 to 70s

  • G: Peak temperature: 235 to 245°C

  • H: Ramp-down slope: 1 to 4°C/s

    Note: The above curve is just an example of the solder paste SAC305. For more details about other solder pastes, please refer to Recommended oven temperature curve in the solder paste specifications.

Storage conditions

WBR1-IPEX Module Datasheet

MOQ and packaging information

Product Number MOQ (pcs) Shipping packaging method The number of modules per reel (pcs) The number of reels per carton (reel)
WBR1-IPEX 4000 Tape reel 1000 4

Appendix: Statement

FCC Caution: Any changes or modifications not expressly approved by the party responsible for compliance could void the user’s authority to operate this device.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

Note: This device has been tested and found to comply with the limits for a Class B digital device, according to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This device generates, uses, and can radiate radio frequency energy and, if not installed and used following the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation.

If this device does cause harmful interference to radio or television reception, which can be determined by turning the device off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

  • Reorient or relocate the receiving antenna.
  • Increase the separation between the device and receiver.
  • Connect the device into an outlet on a circuit different from that to which the receiver is connected.
  • Consult the dealer or an experienced radio/TV technician for help.

Radiation Exposure Statement

This device complies with FCC radiation exposure limits set forth for an uncontrolled rolled environment. This device should be installed and operated with a minimum distance of 20cm between the radiator and your body.

Important Note

This radio module must not be installed to co-locate and operating simultaneously with other radios in the host system except following FCC multi-transmitter product procedures. Additional testing and device authorization may be required to operate simultaneously with other radios.

The availability of some specific channels and/or operational frequency bands are country dependent and are firmware programmed at the factory to match the intended destination. The firmware setting is not accessible by the end-user.

The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B compliance testing with the modular transmitter installed.

The end-user manual shall include all required regulatory information/warnings as shown in this manual, including “This product must be installed and operated with a minimum distance of 20 cm between the radiator and user body”.

This device has got an FCC ID: 2ANDL-WBR1-IPEX. The end product must be labeled in a visible area with the following: “Contains Transmitter Module FCC ID: 2ANDL-WBR1-IPEX”.

This device is intended only for OEM integrators under the following conditions:

The antenna must be installed such that 20cm is maintained between the antenna and users, and the transmitter module may not be co-located with any other transmitter or antenna.

As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed.

Declaration of Conformity European Notice

WBR1-IPEX Module Datasheet

Hereby, Hangzhou Tuya Information Technology Co., Ltd declares that this module product is in compliance with essential requirements and other relevant provisions of Directive 2014/53/EU,2011/65/EU. A copy of the Declaration of conformity can be found at https://www.tuya.com.

WBR1-IPEX Module Datasheet

This product must not be disposed of as normal household waste, in accordance with the EU directive for waste electrical and electronic equipment (WEEE-2012/19/EU). Instead, it should be disposed of by returning it to the point of sale, or to a municipal recycling collection point.

The device could be used with a separation distance of 20cm to the human body.